<p>➀ Stanford researchers developed ultra-thin diamond layers to address chip overheating by spreading heat efficiently, reducing temperatures by up to 70°C in GaN transistors.</p><p>➀ The diamond film, grown at a low 400°C, integrates directly with semiconductors and forms a silicon-carbide interface for effective heat transfer.</p><p>➂ Collaborations with TSMC, Samsung, and Applied Materials aim to commercialize this cooling solution for next-gen high-density chips and 3D chip stacks.</p>