<p>➀ Microsoft developed a new cooling technology by etching microfluidic channels directly into silicon chips, aiming to improve heat dissipation for high-power AI accelerators and future 3D-IC designs;</p><p>➁ The prototype used a 3rd Gen Intel Xeon Scalable processor (likely Ice Lake) with DDR4 RDIMMs, demonstrating leak-proof packaging and structural integrity challenges in channel depth optimization;</p><p>➂ This approach reduces thermal interface layers and increases surface contact, potentially revolutionizing liquid cooling for advanced chip packaging architectures.</p>