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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻，包括HBM、DRAM和NAND等信息。
June 11
- SK Materials Airplus to spend 700 billion won in chip gas1. SK Materials Airplus announced a 700 billion won investment to construct facilities for producing gaseous nitrogen (GN2) and clean dry air (CDA). 2. These gases are crucial for chip manufacturing processes. 3. GN2 serves as a carrier gas in wafer deposition and prevents oxidation.
June 8
- Chip market to grow 16% this year1. The global semiconductor market is projected to expand by 16% in the current year, as reported by World Semiconductor Trade Statistics (WSTS). 2. This growth will elevate the market value to $611.2 billion. 3. WSTS has revised its previous growth estimate from 13.1% to the current projection.
June 1
- Hanwha ends Hanmi’s TC bonder dominance with SK Hynix deal1、韩华精密机械与SK海力克斯达成协议，供應TC bonder_DEVICE，结束汉米的主导地位。 2、SK海力克斯正在对韩华和ASMPT的TC bonder进行评估，计划在今年下半年大量订购。 3、TC bonder的竞争将加剧，以满足SK海力克斯的12栈HBM3E需求。
- Microchip aims to supply FPGA and MCU to Korea’s space industry1、麦克芯片科技瞄准韩国 spaceindustry，计划供给辐射抵抗的 FPGA 和 MCU。 2、该公司在 ASSIC 2024大会上推介了辐射抵抗的 FPGA 和 MCU 单位。 3、麦克芯片科技表示，公司可以为 spaceindustry 提供低功率、高性能、低成本的解决方案。
May 31
- PSK supplies reflow equipment to Micron for HBM1、PSK Holdings向Micron供应返流设备，以生产高带宽内存（HBM）。 2、HBM用于人工智能处理器。 3、PSK Holdings此前曾向三星和SK海力士供应返流设备，现在也向Micron供应订单，以满足所有三大DRAM制造商的需求。
May 30
- SK Hynix to adopt Inpria MOR in 1c DRAM1、SK海力士计划在10nm Gen 6（1c）DRAM生产中使用Inpria的金属氧化物阻抗（MOR）。 2、MOR将被用于绘制1cDRAM的最细线路。 3、Inpria是日本化学公司JSR的子公司，自2022年以来一直与SK海力士合作开发MOR。
May 24
- Nvidia sees Q1 revenue jump 262% from data center demand1、Nvidia 第一季度营收达到 26 亿美元，同比增长 262%。 2、数据中心业务单元贡献了大部分收入，达到 22.6 亿美元。 3、Hopper GPU Chips 的销售是收入增长的主要原因，包括 H100 和 B200。
- South Korea to expand financial support for chip companies1、韩国政府将为本地芯片公司提供扩大的财政支持，总额为20万亿韩元。 2、该支持计划将由韩国工业银行实施，提供17万亿韩元的贷款支持。 3、韩国政府还将加快半导体巨型集群的建设，计划投资26万亿韩元。
May 22
- Samsung to use Snapdragon 8 Gen 3 in Flip 6, Fold 61、三星电子将在即将推出的Galaxy Z Flip 6和Galaxy Z Fold 6折叠式手机中使用高通骁龙8 Gen 3处理器。 2、三星电子将继续使用高通的应用处理器，因为此举可以提高效率和降低成本。 3、新的手机将于7月10日在巴黎举行的Galaxy Unpacked活动中亮相。
- Can Samsung recover its position as a leader in chips?1、三星电子芯片业务单元去年录得15万亿韩元亏损，是其最差的一年。 2、该单元技术领导地位也受到质疑，一些人认为它在传统内存芯片领域没有超过SK海力士和美光的优势。 3、新任命的芯片业务单元chief Jun Young-hyun面临许多挑战，包括通过Nvidia的质量测试，获得高带宽内存芯片的竞争力等。
May 21
- Asicland wins AI firm D.notitia as customer1、台湾-semiconductor公司Asicland获得AI芯片公司D.notitia为客户。 2、D.notitia计划在Asicland设计的芯片上添加软件栈，并将AI解决方案供应给其他公司。 3、Asicland还与另一家韩国AI芯片公司签订了10亿韩元的合约。
- Asicland wins AI firm D.notitia as customer1、Asicland获得AI公司D.notitia的订单，价值9.7亿元韩元。 2、D.notitia将使用Asicland设计的SoC来运行其大型语言模型（LLM）。 3、Asicland还与另一个韩国AI公司签订了价值10亿元的订单。
- Samsung develops a 16-stack 3D DRAM1、三星开发了16栈3D DRAM，超过Micron的8栈技术。 2、该技术可以将存储单元和逻辑单元分开，提高存储密度。 3、三星还研究了垂直通道晶体管（VCT）技术，以减少die表面积。
May 20
- SK Hynix’s customer deposit jumps again from HBM1、SK海力士在2024年第一季度的客户存款再次上涨，达到56.1亿韩元。 2、这是由于Nvidia给予的先期支付，确保稳定的高带宽存储器(HBM)供应。 3、SK海力士已经售出2024年的HBM生产能力，2025年的生产能力也基本售出。
May 17
- South Korea to open AI chip center in San Jose1、韩国计划在美国圣何塞开设人工智能芯片创新中心，以促进国内系统芯片公司在美国的销售。2、该中心将为三到四家公司提供独立办公室，并提供一个大的开放空间供其他公司使用。3、该项目是韩国贸易、工业和能源部的一项计划，旨在推广系统半导体技术出口。
May 16
- LPKF to supply laser kit for glass chip boards to customers in Asia, CEO says1、LPKF 将为亚洲客户供应激光设备，用于生产玻璃芯片板。2、玻璃芯片板的生产需要经历通过玻璃维亚（TGV）过程。3、LPKF 的激光etching 技术可以解决TGV 过程中的障碍。
May 15
- WONST aims to hit 100 billion won in revenue this yearBearing maker WONST is targeting an annual revenue of 100 billion won this year, CEO Lee Taek-won told TheElec.The company is aiming to list on the Korean bourse next year on the back of hitting the revenue target, Lee said.WONST had originally aimed to go public this year, deciding on Shinhan Secur
May 14
- SK Hynix aims to manufacture HBM4E in 2026SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee
- Raontech’s LCoS tech to go in Cadillac’s new EVSouth Korean microdisplay firm Raontech signed a deal with the UK’s Envisics to supply liquid crystal on silicon (LCoS) backplane wafers, TheElec has learned.Raontech said last month that it signed a deal worth 1.2 billion won to supply LCoS backplane wafers. It also signed a technology development
May 10
- CGP Materials aims for 150 billion won in revenue trough chip patterning materialCGP Materials is aiming to reach 150 billion won in annual revenue by 2027 through the expansion of its semiconductor patterning material business.The electronic material firm said on Thursday that it has started construction of a new factory in Sejong City.CGP Materials CEO Park Chun-geun said duri
- US chip production capacity to triple by 2032 thanks to CHIPS ActThe US chip production capacity is expected to triple from 2022 to 2032 from the enactment of the CHIPS and Science Act, but extending current support and considering additional measures was needed to “stay the course”, according to a joint report by the Semiconductor Industry Association (SIA) and
May 9
- Qualitas to raise funds for research into UCIe PHY IP for chipletsQualtias Semiconductor said on Tuesday that it will raise 59.5 billion won through a share offering.Out of the total, 57.5 billion won will be spent up to 2027 for the research and development of new chip IPs, the company said,49.5 billion won will be spent on next-generation products and the applic
- Worldwide chip revenues jump 15.2% in Q1The worldwide semiconductor industry is showing clear signs of a recovery.According to the Semiconductor Industry Association (SIA), the US trade body, worldwide semiconductor revenues jumped 15.2% on-year to US$137.7 billion in the first quarter. Revenues dropped 5.7% from the fourth quarter.The on
May 8
- Intel secures high-NA EUV kits over rivalsIntel has secured the majority of high-NA extreme ultraviolet (EUV) equipment that ASML is manufacturing up to the first half of next year, TheElec has learned,The Dutch fab equipment maker is manufacturing five units of the kit this year, which will all go to the US chipmaker, sources said.As ASML’
May 7
- Samsung takes two-track approach to HBM developmentSamsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration
May 3
- SK Hynix expects HBM revenue to hit mid-$10 billion within yearSK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp
- SK Hynix testing Tokyo Electron’s cryo etching equipmentSK Hynix is testing the performance of Tokyo Electron’s cryogenic etching equipment, TheElec has learned.The South Korean memory chipmaker has sent test wafers to the fab equipment maker for the tests instead of installing them in its own fab, sources said.Tokyo Electron’s new kit etches at high spe
May 2
- LG Chem testing build-up film with FC-BGA customerSouth Korean chemical giant LG Chem was testing its own build-up film with a potential flip-chip ball grid array (FC-BGA) customer, a company researcher said.Builder-up films are an insulating film used in chip packages such as FC-BGA and glass substrates.The industry mostly uses Ajinomoto Build-Up
- Samsung returns to profitability in chips in first-quarterSamsung’s chip division has returned to profitability in the first quarter on the back of the recovery of the memory chip market.The South Korean electronics maker said on Tuesday that it recorded 71.92 trillion won in revenue and 6.61 trillion won in operating profit, an increase of 13% and 932%, r
April 30
- South Korea passes project to develop advanced chip packagingA national project to promote the development of advanced technologies in chip packaging has been passed by the South Korean government, TheElec has learned.It passed the preliminary feasibility review of Korea Institute of S&T Evaluation and Planning, a government think tank to set policies for sci