➀ Colab Platforms Ltd has announced plans to establish a fully owned subsidiary in India, Colab Semiconductor Pvt Ltd, focused on semiconductor manufacturing and OSAT.

➁ The new unit aims to support India's domestic chip supply chain and capitalize on the country's growing semiconductor market.

➂ Colab Platforms believes the Indian chip market will grow from $52 billion in 2024-25 to $108 billion by 2030, with a CAGR of about 15%.

➀ Substrate, a San Francisco-based startup, is developing an alternative semiconductor manufacturing process that could reduce costs by half;

➁ The company has received over $100 million in investment and is using particle accelerators in its process;

➂ Substrate aims to compete with industry leaders like ASML, which currently dominates the market for semiconductor manufacturing equipment.

➀ PI showcases high-precision motion systems, including linear stages and piezo-driven nano-focus motors, for super-resolution microscopy and live-cell imaging at Neuroscience 2025;

➁ Advanced solutions like 6-axis hexapod manipulators and low-profile XY stages support microsurgery robotics and rapid 3D imaging;

➂ Compact voice-coil stages and nanopositioning systems emphasize OEM integration and enhanced resolution for DNA sequencing and bio-nanotechnology.

➀ Substrate, a Peter Thiel-backed startup, raised $100 million to compete with ASML in lithography tools using X-Ray technology;

➁ Its proprietary particle accelerator-based X-Ray lithography claims to produce wafers at a fraction of ASML's EUV cost, achieving 2nm resolution;

➂ The team includes experts from TSMC, Applied Materials, and U.S. National Labs, with validation from defense and intelligence-linked investors like In-Q-Tel.

➀ POLYN Technology has validated its Neuromorphic Analogue Signal Processing (NASP) chip, which performs AI inference in the analog domain with microwatt-level power consumption, significantly lower than digital processors;

➁ The NASP platform processes sensor signals in their native analog form, targeting always-on edge devices for applications like wearables, automotive sensing, and robotics;

➂ The first chip features a Voice Activity Detection (VAD) core, with future plans for speaker recognition and voice extraction, and evaluation kits are now available for ultra-low-power voice control development.

➀ Nordic Semiconductor launched an open-source Android app (nRF Toolbox) to support Bluetooth Channel Sounding, integrated with its nRF54L Series SoCs;

➁ The solution demonstrates interoperability with Google Pixel 10 smartphones, achieving ±1m accuracy within 20m range for applications like asset tracking and indoor positioning;

➂ Nordic played a key role in developing the Bluetooth LE standard, leveraging its expertise to drive adoption in healthcare, retail, and industrial sectors.

➀ Samsung led global smartphone shipments in Q2 2025 with 58 million units and 19.7% market share, followed by Apple (15.7%) and Xiaomi (14.4%);

➁ vivo and Transsion ranked fourth and fifth, with Transsion experiencing a 1.7% YoY decline;

➂ Total shipments increased 1% YoY to 295.2 million units, while 'Others' category declined by 3.1%.

➀ The semiconductor industry is advancing towards sub-2nm chip technology, facing challenges like traditional lithography limitations and quality control complexities.

➁ Advanced deposition chemistry, such as ALD and CVD, is being explored to overcome these challenges, with companies like Lam Research developing new tools for atomic layer deposition.

➂ Korean researchers have achieved a breakthrough in large-area semiconductor fabrication using plasma-enhanced deposition, potentially leading to solutions for sub-2nm manufacturing.

➃ Intel is preparing for advanced chip production with a roadmap to develop five nodes in four years, aiming to reduce dependence on external foundries.

➀ Researchers developed Surface Immobilised Electrides, enabling free electron movement for quantum applications;

➁ New material offers improved stability and scalability over previous electrides;

➂ Potential uses in quantum computing and efficient chemical production systems.

➀ Mouser signs a global distribution agreement with Northern Technologies, a division of EDAC Group specializing in data communication shielding products;

➀ The agreement enables Mouser to stock a variety of Northern Technologies connectors, including D-subminiature solder cup connectors, dust covers, and crimp connectors, featuring high-density designs, durable materials (steel, copper alloy), and robust electrical specifications (e.g., 3A current, 250V AC voltage);

➃ Products emphasize protection against environmental contaminants, minimal signal loss, and compatibility across temperature ranges (-55°C to 105°C).

➀ Researchers at the University of Würzburg developed a topological insulator that operates at higher temperatures (around -213°C), overcoming previous limitations of functioning near absolute zero;

➁ The material uses a three-layer quantum well structure (InAs/GaInSb/InAs) to enhance band-gap energy and structural symmetry, enabling robust spin-polarized electron transport;

➂ This breakthrough enables compatibility with existing silicon-chip technology, paving the way for energy-efficient topological electronics in practical applications.

➀ Researchers at the University of Würzburg developed a topological insulator functioning at higher temperatures (−213°C), overcoming previous limitations requiring near-absolute-zero conditions;

➁ The material features a three-layer quantum well (InAs/GaInSb/InAs), enhancing bandgap energy and structural symmetry for robust, low-loss electron transport;

➂ This breakthrough paves the way for energy-efficient topological electronics compatible with silicon chip technology, enabling scalable and reliable applications.

➀ The JTF3 G3 tray feeder by Quasys automates precise placement of heavy/sensitive chips onto PCBs, enhancing assembly line efficiency;

➁ It supports up to 24 trays, handles components up to 600g per tray, and achieves positioning accuracy within ±50 micrometers;

➂ Equipped with safety sensors and standard interfaces, it integrates seamlessly into existing systems while improving production speed and reliability.

➀ TU Ilmenau launches a 3-year research project using EEG-based Brain-Computer Interfaces (BCIs) combined with rehabilitation robots to improve lower limb mobility recovery in stroke patients.

➁ The project focuses on developing novel convolutional neural network algorithms to enhance EEG signal analysis and "Motor Imagery" accuracy for legs and pelvis rehabilitation.

➂ This approach aims to provide new neurofeedback-driven rehabilitation strategies, potentially restoring quality of life for stroke survivors.

➀ Nisshinbo Micro Devices launched the MUSES8921, a JFET input dual op-amp for high-fidelity audio applications in home, professional, and automotive systems;

➁ Built on its predecessor MUSES8920/A, the chip features ultra-low noise (8.0 nV/√Hz), minimal distortion (0.0004%), and a high slew rate (25 V/µs) for precise audio reproduction;

➂ Designed with optimized circuit layout and flexible voltage support (±3.5 V to ±17 V), it comes in compact packages (EMP-8-AN, DFN4035-8-GR) for space-constrained applications.

➀ Alice & Bob, alongside PLASSYS-BESTEK and the French defense innovation agency (AID), delivered the SQUID-6 UHV quantum chip fabrication tool for the ULTRACAT project;

➁ The equipment supports a new Paris lab to prototype cat-qubit chips, aiming to accelerate fault-tolerant quantum processor development;

➂ The project enhances Josephson junction fabrication technology, backed by French defense funding to boost Europe’s quantum sovereignty.

➀ Traditional chip cooling methods dissipate heat from the surface, creating localized hot spots (dark silicon) that limit performance and energy efficiency.

➁ Researchers propose photonic cooling using anti-Stokes fluorescence, where targeted laser light absorbs heat from inside the chip and converts it into higher-energy light, enabled by a thin photonic cold plate and optical layers.

➂ Early tests show this method outperforms conventional air/liquid cooling with lower power consumption, potentially boosting processing speeds, reducing energy use, and recycling waste heat as light energy.

➀ Jonathan Goldberg warns of a classic bubble forming in the semiconductor sector due to the AI boom.

➁ He discusses the rise of Neo-Cloud companies and the financial implications of partnerships like OpenAI and AMD.

➂ Goldberg expresses concerns about China's rapid advancements in semiconductor technology, particularly Huawei's development of EUV lithography and the potential impact on global markets.

➀ Intel reported $13.7 billion in revenue in Q3, a 3% year-over-year gain;

➁ The earnings reflect improved execution and increased demand for compute products in the AI era;

➂ Intel's Client and Computing Group saw a 5% year-over-year gain, while Data Center and AI slipped 1%;

➃ Intel expects its fourth quarter revenue to fall between $12.8 billion to $13.8 billion.

➀ Tesla's Q3 2025 profits dropped 37% YoY to $1.37 billion, continuing a year-long decline;

➁ The company cited U.S. tariffs and restructuring costs as key factors, with cumulative Jan-Sept profits also down 37% compared to 2024;

➂ Analysts anticipate a tougher Q4, predicting slowed sales growth and noting Tesla's loss of EV market leadership to BYD.