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July 10
- Production AI is Taking Off But Not Where You Think1. AI growth is happening in consumer devices and IoT, focusing on practical applications like noise cancellation and predictive maintenance. 2. The tinyML Foundation is forming a common interest group for product makers in this space. 3. Ceva's NeuPro-Nano addresses tinyML profiles with high performance and low energy consumption, supporting scalable neural engines and standard inference frameworks.
- Facing challenges of implementing Post-Quantum Cryptography1. The urgency to implement Post-Quantum Cryptography (PQC) is driven by potential future decryption capabilities of quantum computers. 2. NIST and NSA have initiated PQC algorithm selections and recommendations, targeting full PQC implementation by 2033. 3. Secure-IC addresses practical challenges in PQC implementation, including performance, hybridization, and certification complexities.
July 9
- Breker Brings RISC-V Verification to the Next Level #61DAC1. Breker Verification Systems introduces advanced RISC-V verification solutions at #61DAC, covering core verification and system coherency. 2. The company's Trek family leverages AI technology for test suite synthesis, enhancing bug detection and coverage. 3. Breker's solutions support multiple environments including simulation, emulation, and post-silicon, ensuring comprehensive verification for complex semiconductor designs.
July 8
- My Experience at #61DAC1. The 61st Design Automation Conference (DAC) focused on the theme 'Chips to Systems', reflecting the industry's shift from traditional chip makers to system companies designing their own chips. 2. AI was a prominent topic at the conference, with Nvidia being highlighted as a major beneficiary of the AI surge. 3. The conference showcased a mix of established and new companies, emphasizing the depth of experience within the semiconductor ecosystem.
- Intel’s Gary Patton Shows the Way to a Systems Foundry #61DAC1. Intel's Gary Patton emphasizes the importance of a systems foundry in the semiconductor industry, focusing on AI and multi-die, heterogeneous design. 2. The systems foundry initiative aims to lead in defining the future of semiconductor design and manufacturing, requiring disruptive innovation beyond Moore's Law scaling. 3. Intel is investing in advanced packaging and collaborating with ecosystem partners to achieve significant improvements in energy efficiency and interconnect density.
July 5
- CEO Interview: David Heard of Infinera1. David Heard, CEO of Infinera, has been leading the company since November 2020, focusing on innovation and operational excellence. 2. Infinera specializes in optical semiconductors and high-speed connectivity solutions, addressing the growing bandwidth demands. 3. The company leverages its vertical integration capabilities to provide scalable and cost-effective solutions, enhancing network capacity and efficiency.
July 4
- CEO Interview: Dr. Matthew Putman of Nanotronics1. Dr. Matthew Putman, CEO of Nanotronics, discusses the company's use of AI and advanced imaging to improve manufacturing efficiency and detect flaws. 2. Nanotronics has developed Cubefabs, modular manufacturing units that democratize access to high-tech production facilities. 3. The company focuses on enhancing yields and energy efficiency in factories, serving a wide range of industries including semiconductors and biotechnology.
- Solido Siemens and the University of Saskatchewan1. Siemens has donated to create a tenured professor chair at the University of Saskatchewan to foster local talent in electronic design automation (EDA). 2. The chair will focus on advancing EDA research and teaching, benefiting the next generation of electronic device development. 3. Applications are open for the Siemens EDA Chair in Electronic Design Automation, aiming to establish a research program and engage with local industry.
July 3
- Insights into Automotive AI in China1. China's automotive industry is the largest in the world by unit production and is expanding globally. 2. Chinese research in ADAS and autonomy is accelerating rapidly, driven by tariffs/embargos. 3. Active R&D includes AR HUD, driver monitoring systems, and ADAS testing. 4. Challenges include low enthusiasm for AI features, weak linkage between hardware and software teams, and regulatory concerns.
July 2
- Automotive Designs Have No Room for Error!1. Automotive designs require high fault tolerance, achieved through error correcting codes (ECC). 2. ECC can be applied to memory and interconnect busses for error detection and correction. 3. SECDED is a popular choice for automotive designs, though implementation varies. 4. End-to-end ECC is challenging due to differing IP block support and NoC data handling. 5. Multiple ECC stages add complexity but enhance error protection.
- LIVE WEBINAR Maximizing SoC Energy Efficiency: The Role of Realistic Workloads and Massively Parallel Power Analysis1. The complexity of modern SoC designs requires realistic workloads and advanced power analysis methods to improve energy efficiency. 2. Traditional methods using synthetic simulation vectors often underestimate power consumption and lead to inefficient optimization. 3. Incorporating software-driven workloads and advanced analysis techniques enables accurate power consumption assessment and early optimization in the design process.
July 1
- Career in EDA Versus Chip Design: Solving the Dilemma1. The article compares careers in chip design and EDA, highlighting the author's transition from chip design to leading an Application Engineering team at Ansys. 2. It outlines the advantages of an EDA career, including technical exposure, cross-team collaboration, business acumen, work culture, and industry stability. 3. The future of EDA is seen as bright due to the increasing reliance on EDA tools in areas like AI and Machine Learning.
June 28
- VLSI Technology Symposium – Intel describes i3 process, how does it measure up?1. Intel has released details on their i3 process at the VLSI Technology Symposium, which will enter production in 2024 with both high performance and high-density cells achieving approximately 148 MTx/mm² transistor density. 2. The i3 process offers multiple variants targeted at different applications, including client, server, chipsets, storage, high performance computing, and AI. 3. Intel's i3 process represents a significant improvement over the i4 process with better density and performance, making it a more competitive foundry process.
- Three New Circuit Simulators from Siemens EDA1. Siemens EDA has introduced three new circuit simulators under the Solido Simulation Suite to address the increasing demands for higher performance and capacity in 7nm and smaller nodes. 2. The new simulators include Solido SPICE, Solido LibSPICE, and Solido FastSPICE, each designed for different requirements and integration with other Siemens EDA tools. 3. Early customer results indicate significant speed improvements ranging from 2X to 68X, while maintaining accuracy, with endorsements from major semiconductor companies.
June 27
- Siemens Provides a Complete 3D IC Solution with Innovator3D IC1. Siemens has introduced Innovator3D IC, a comprehensive solution for 3D IC design, focusing on early feasibility planning and analysis. 2. The solution includes a unified cockpit for design planning, prototyping, and predictive multi-physics analysis, leveraging digital twin technology. 3. Innovator3D IC supports industry standards and integrates AI for co-optimization, ensuring efficient and reliable 3D IC system designs.
- New EDA Tool for 3D Thermal Analysis1. Siemens EDA introduces Calibre 3DThermal, a new tool for early thermal analysis in chiplet and 3D IC designs. 2. The tool enables efficient shift-left analysis and verification, allowing teams to start thermal analysis early in the design process. 3. Calibre 3DThermal integrates with existing Siemens EDA tools and supports multi-physics analysis, aiding in meeting thermal, power, and timing goals.
June 26
- Novelty-Based Methods for Random Test Selection. Innovation in Verification1. The article discusses the use of neural networks in enhancing randomized testing by focusing on novelty-based test selection to improve functional coverage. 2. It highlights a study where different neural network methods were applied to guide the selection of configuration register values in an automotive RADAR signal processing unit, significantly reducing the number of simulations needed. 3. The results show that using a coverage-focused neural network can achieve a substantial reduction in the simulations required to reach high coverage levels, though with variability.
- Lab on Cloud Demonstration1. TenXer Labs has developed a Lab-on-Cloud service with over 80 Evaluation Kits accessible via a web interface, streamlining the process for systems engineers to select and test ICs. 2. The demonstration included a Renesas board for a single-burner induction cooktop and a 3D gesture control board, showcasing real-time measurements and control. 3. LiveBench, the platform used, supports multiple languages and is free for systems engineers, with a fee for AEs demonstrating company devices.
June 25
- Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure1. Synopsys introduces the industry's first complete PCIe 7.0 IP solution, designed to meet the increasing demands of AI and high-performance computing. 2. The solution features doubled bandwidth and support for linear direct drive optics, enhancing signal integrity and performance. 3. Synopsys' early access program and complete solution approach ensure robust, reliable technology ahead of mainstream adoption.
- Automotive Semiconductor Market Slowing1. The automotive semiconductor market was estimated at $67 billion in 2023, showing a 12% increase from 2022. 2. Infineon Technologies, NXP Semiconductors, and STMicroelectronics are the top three suppliers, collectively holding over one-third of the market. 3. Despite the growth in vehicle production, the market is showing signs of slowdown, with key players experiencing declining revenues in recent quarters.
- System VIPs are to PSS as Apps are to Formal1. The article discusses the relationship between System VIPs and PSS (Portable Stimulus Standard), highlighting the need for scalable, out-of-the-box solutions for system verification. 2. It explains that while PSS is a powerful tool for defining system-level tests, there is a growing demand for more canned system VIP solutions that simplify the testing process for non-experts. 3. The article also outlines the basic requirements and functionalities of System VIPs, emphasizing their role in generating traffic and monitoring system-level behaviors like cache coherence.
June 24
- Silicon Catalyst Ventures Launched With 8 Fundings1. Silicon Catalyst Ventures has been launched to support semiconductor startups with an investment range of $10M to $20M in its first series. 2. The venture is led by experienced professionals like Dr. Shih-Wei Sun, former CEO of UMC, and focuses on early-stage entrepreneurial teams. 3. Initial investments have been made in companies like Applied Brain Research and Eridan Communications, sourced primarily from the Silicon Catalyst Incubator.
June 21
- Pragmatic at the 2024 Design Automation Conference1. Pragmatic Semiconductor is showcasing its innovative FlexIC technology at the 2024 Design Automation Conference, offering a sustainable and cost-effective alternative to traditional silicon chips. 2. The company's FlexIC Foundry enables rapid production and customization of flexible integrated circuits, reducing energy consumption and environmental impact. 3. Pragmatic will display its latest products including PlasticARM, an electronic nose, temperature sensors, and NFC products at stand 1534.
- Empyrean at the 2024 Design Automation Conference1. Empyrean Technologies is set to showcase its comprehensive Custom IC and PMIC design solutions at DAC 2024, featuring tools that support advanced nodes like 5nm and 3nm. 2. The suite includes seamless integration with various tools like ALPS-GT, Argus, and Patron™, enhancing workflow efficiency and reliability analysis. 3. Empyrean also offers digital SoC design solutions, ensuring high performance and accuracy in modern electronic designs.
- AMIQ EDA at the 2024 Design Automation Conference1. AMIQ EDA, a leader in hardware design and verification IDEs, is attending the 2024 DAC to showcase new features in their DVT Eclipse IDE and DVT IDE for Visual Studio Code, including runtime elaboration of UVM code and support for SystemVerilog AMS. 2. The company has enhanced its tools to handle preprocessor statements in various languages, improving code development efficiency. 3. AMIQ EDA also sponsors the City Bytes & Beverages Hospitality Zone at DAC, offering an alternative to typical convention food.
June 20
- Verific at the 2024 Design Automation Conference1. Verific Design Automation will host two AI EDA startups, Primis.ai and Silimate, at the 2024 Design Automation Conference, showcasing their use of AI in chip design. 2. Primis.ai offers a generative AI solution for chip design, enhancing productivity with natural language interfaces. 3. Silimate, backed by Y Combinator, provides real-time functional bug detection and PPA issue prediction for chip designers.
- SmartDV at the 2024 Design Automation Conference1. SmartDV emphasizes connections, support, and the human side of IP at the 61st Design Automation Conference. 2. The company has revamped its customer support model, implementing a customer success portal and refining product delivery processes. 3. SmartDV showcases its diverse range of design IP and VIP, inviting attendees to customize LEGO Minifigs and discuss future design projects at their booth.
- Blue Pearl Software at the 2024 Design Automation Conference1. Blue Pearl Software is celebrating 20 years since its first showcase of ASIC and FPGA static verification at the 2004 Design Automation Conference. 2. The Visual Verification Suite has evolved to offer advanced verification tools for ASIC, FPGA, and IP RTL, including structural and formal linting, constraint generation, and analysis packages for glitches and clock domain crossings. 3. The suite also features a Management Dashboard for progress tracking and has partnered with Accellera to standardize CDC/RDC/Glitch intent capture, addressing the challenge of IP reuse in different verification environments.
- Primarius Technologies at the 2024 Design Automation Conference1. Primarius Technologies showcased its extensive product portfolio at DAC 2024, focusing on optimizing designs for yield, power, performance, and area. 2. The company highlighted tools like ESDi, PTM, SDEP, NanoSpice X, NanoSpice Pro X, and NanoCell, which are essential for advanced chip design and simulation. 3. Primarius' products are crucial for chip companies as they face increasing complexity in IC technology and manufacturing processes.
June 19
- Agnisys at the 2024 Design Automation Conference1. Agnisys, a leader in hardware design and verification automation, is set to make a significant impact at DAC 2024 with various engaging activities. 2. The company is sponsoring 'I LOVE DAC' and offering 44 promo codes for premium Engineering Tracks. 3. Agnisys is hosting a design contest featuring its IDS-NG tool, showcasing its efficiency in digital design.