Author page description
August 29
- Unsourced Random Access
➀ Researchers from Skoltech have published a monograph on "Unsourced Random Access," targeting efficient communication for millions of IoT devices in 5G Advanced/6G networks;
➁ The proposed method allows devices to connect without pre-coordination or identification, reducing delays and improving energy efficiency;
➂ The monograph integrates theoretical frameworks with practical implementations, supported by collaborations with MIT and other institutions under the Russian Science Foundation.
- Being A Good Guesser
➀ Predicting the semiconductor industry's future remains highly uncertain, as seen in NVIDIA outpacing Intel in revenue and market cap despite past expectations;
➁ Industry dynamics hinge on technological shifts (e.g., CMOS adoption) and strategic bets (e.g., IBM's 8088 choice), with misaligned trends leading to failures;
➂ Success requires balancing investments, management, and engineering while navigating unpredictable market demands—making 'good guessing' a crucial skill.
August 28
- Nvidia has $46.7bn Q2 forecasts $54bn Q3
➀ NVIDIA reported Q2 2025 revenue of $46.7 billion, a 56% YoY increase (smallest in two years), with China revenue plunging 50% QoQ and 25% YoY to $2.8 billion;
➁ Q3 revenue forecast is $54 billion (excluding China), but could rise by $3-5 billion if H20 AI chip sales to China are permitted;
➂ CFO Colette Kress projected AI infrastructure spending to reach $3-4 trillion by 2030, with $600 billion spent in 2025 alone.
- Bluetooth LE audio Click development board
➀ Mikroe introduces a Bluetooth LE Audio Click development board based on IOT747's module (with Qualcomm chip), supporting unicast and Auracast;
➁ Supports Classic and LE Audio modes, multiple Bluetooth profiles, certifications (FCC, RED, etc.), and applications in home entertainment, automotive infotainment, and industrial systems;
➂ Includes Android/iOS apps, PCM digital audio interface, headphone amplifier, onboard microphone, and libraries for easy integration.
August 27
- Starfish inspires gripper surface for underwater robots
➀ Seoul National University of Science and Technology developed a bio-inspired gripper for underwater robots, mimicking starfish tube feet using a hydrogel-rigid stem structure;
➁ The gripper achieves strong underwater adhesion (up to 65kPa) via vacuum mechanics during detachment, with release mechanisms via mechanical angling or fluid pressure;
➂ Potential applications include micro-LED chip handling, biomedical devices, and surgical tools adhering to wet surfaces.
- DigiKey launches Back to School Giveaway for university students
➀ DigiKey launches its annual Back to School Giveaway, offering university students prizes including a Teledyne LeCroy Power Supply and electronics toolkits;
➁ Additional prizes feature tools from Aven, Pokit Innovations, Weidmüller, and Adafruit, along with branded merchandise;
➂ The contest runs until October 24, 2025, with winners selected randomly and announced in mid-November, requiring no purchase for entry.
- Cloud Services To Be Worth $400bn+ This Year
➀ Cloud infrastructure service revenues reached $330 billion in 2024 and are projected to exceed $400 billion in 2025, driven by 25% year-over-year growth;
➁ Generative AI is a key growth driver, with the market expected to maintain over 20% annual growth for the next five years;
➂ AWS and Azure dominate the market, with Amazon accounting for 30% of global cloud revenue ($100+ billion annually) and generating $40 billion in operating profit in 2024.
- Over-the-air updates for MCU with segment LCD and touch controllers
➀ Renesas launches RL78/L23 MCUs with dual-bank memory for over-the-air updates, targeting smart home appliances and IoT applications；
➁ Features include a low-power 16-bit core, LCD controller with 30% reduced current, touch support (up to 36 keys), and 1.6-5.5V operation；
➂ Designed for 5V industrial use and battery-powered systems, with safety compliance and dynamic power-saving modes.
- 64Gbit/s die-to-die interconnect
➀ Marvell Technology introduces a 64Gbit/s bi-directional die-to-die interconnect for xPUs on 2nm and 3nm processes;
➁ The interface achieves over 30Tbit/s/mm bandwidth density, exceeding UCIe by 3x, with adaptive power management reducing consumption by up to 75%;
➂ Features include redundant lanes, automatic repair, and a complete stack spanning application bridge, link layers, and physical interconnect.
- Qualcomm adds UHF RFID to mobile processor
➀ Qualcomm launches Dragonwing Q-6690, the first enterprise mobile processor with integrated UHF RFID, 5G, Wi-Fi 7, Bluetooth 6.0, and UWB;
➁ Enables proximity-aware applications in retail, logistics, and industrial sectors, with adoption by OEMs like Zebra and Honeywell;
➂ Offers software-configurable feature packs and over-the-air updates, reducing hardware redesign needs and extending product lifecycles.
- Infineon and Nvidia working on humanoid robots
➀ Infineon and Nvidia collaborate to accelerate humanoid robot development by combining Infineon's MCUs, sensors, GaN transistors, and Marvell's Automotive Ethernet technology with Nvidia's Jetson Thor AI modules;
➁ The partnership focuses on precise motor control, real-time AI processing, and secure connectivity for industrial, logistics, and healthcare applications;
➂ Key components include Infineon's PSOC Control C3 MCUs for field-oriented-control algorithms and NVIDIA Holoscan Sensor Bridge integration.
- O-RAN stabilising
➀ Open RAN has progressed since 2018, nearing $10B cumulative revenue, but faces mixed adoption and rising market concentration in RAN;
➁ After rapid growth in Japan and the U.S., Open RAN revenues declined by ~40% over two years due to slowed 5G investments, but signs of stabilization emerged in 2Q25;
➂ Long-term growth prospects remain positive, with Virtualised RAN revenue expected to rise in 2025 and multi-vendor RAN projected to reach $2B-$3B by 2029, led by Samsung, Rakuten Symphony, and Fujitsu.
- Top Ten (less 5) Smartphone Vendors In Q2
➀ IDC data reveals the top 5 smartphone vendors by Q2 2025 shipments: Samsung (58 million), Apple (46.4 million), Xiaomi (42.5 million), Vivo (27.1 million), and Transsion (25.1 million);
➁ Samsung maintains its leadership with the highest shipment volume, followed by Apple and Xiaomi in the top three;
➂ The report highlights the competitive landscape of the global smartphone market, with emerging players like Transsion gaining traction.
August 26
- Prophesee adds event-based neuromorphic vision to Raspberry Pi
➀ Prophesee launched the GenX320 Starter Kit for Raspberry Pi 5, integrating event-based neuromorphic vision to enable real-time applications across drones, robotics, and industrial automation;
➁ The sensor captures pixel-level brightness changes ('events') instead of full-frame images, achieving microsecond response times, ultra-low power consumption (<50 mW), and reduced data processing;
➂ Developers gain access to open-source tools (Python/C++ APIs), a 320×320 resolution sensor with 140 dB dynamic range, and resources via Prophesee's Knowledge Center to accelerate edge computing solutions.
- Nvidia Drive AGX Thor developer kit available for pre-order
➀ NVIDIA DRIVE AGX Thor 开发者套件已开放预购，计划于9月发货，基于 Arm Neoverse V3AE CPU，专为自动驾驶的复杂 AI 工作负载设计；
➁ 平台结合 Arm 架构的确定性性能与 NVIDIA Blackwell GPU，提供最高 2,000 FP4 万亿次算力，支持预测性 ADAS、实时驾驶监控及语音交互等多任务同步运行；
➂ 提供桌面版（SKU10）和车载版（SKU12）两种开发套件，并推出 Jetson Thor 平台，将同款架构扩展至机器人及物理 AI 领域，赋能实时多模型 AI 工作流。
- Companies would rather give up Chips Act grants than give equity to the US government
➀ Companies like TSMC threaten to forgo U.S. Chips Act grants (e.g., TSMC’s $6.6 million subsidy) if required to grant equity to the government, unlike Intel, which accepted the terms in exchange for funding;
➁ The U.S. government acquired 433.3 million Intel shares (9.9% stake) at $20.47 per share, with no board rights but voting alignment, plus a warrant for 5% more shares if Intel’s foundry ownership drops below 51%;
➂ Analysts warn Intel’s deal risks shareholder dilution (10%) and pressure to deliver projects like the Ohio fab, reflecting broader industry resistance to equity-for-subsidy clauses.
- A new age for inertial navigation
➀ Nordic Inertial and Murata developed a MEMS-based inertial navigation system combining new algorithms and mass-produced sensors, achieving positioning accuracy close to navigation-grade standards;
➁ The system maintains sub-10-meter accuracy in GNSS-free environments (e.g., tunnels, parking garages) using a Raspberry Pi 5 and MEMS IMU, providing real-time geological north-referenced positioning;
➂ Addressing GNSS vulnerabilities, the collaboration aims to revolutionize industries like logistics and automotive with scalable, cost-effective inertial navigation solutions, marking a resurgence of the technology.
- NEC fibre system predicts traffic congestion
➀ NEC developed an optical fiber sensing technology using existing cables and AI models to monitor road conditions and predict sudden traffic congestion with 80% higher accuracy than traditional methods;
➁ The system integrates real-time traffic data through advanced algorithms, optimizing simulations of traffic flow for reliable congestion prediction and detour planning;
➂ NEC is advancing a dynamic road digital twin for network-wide traffic management, aiming for practical deployment by 2026 after real-world trials with authorities.
- US ATC Association criticises Govt. and FAA
➀ The US Air Traffic Control Association criticized the slow progress in resolving air traffic control system issues, highlighting the lack of a comprehensive plan since 1957;
➁ Despite congressional acts (1957 Airways Modernization Act and 1958 Federal Aviation Act) and allocated funds, no effective system plan was developed over three years;
➂ The root issue stems from failure to clearly define the problem, hindering solutions despite extensive expert analysis.
August 25
- Beijing tries to hinder diversification out of China
➀ The Chinese government pressured Foxconn to withdraw 300 engineers from its Indian factories and cancel plans to send 60 more, replacing them with Taiwanese engineers;
➁ This is part of Beijing's strategy to hinder Apple's shift of iPhone assembly from China to India and slow down manufacturing diversification;
➂ China aims to restrict the export of technical expertise, skilled personnel, and equipment to maintain its manufacturing dominance.
- Nvidia unifies datacentres into giga-scale AI factories
➀ NVIDIA introduces **Spectrum-XGS Ethernet** to unify geographically distributed data centers into giga-scale AI factories, addressing power and capacity limitations;
➁ The platform enhances performance via adaptive algorithms, nearly doubling communication efficiency for multi-GPU clusters, enabling seamless operation as a single AI super-factory;
➂ Hyperscale partners like CoreWeave adopt the technology, leveraging its high bandwidth density and energy-efficient scalability for next-gen AI infrastructure.
- RAN revenues up three quarters running
➀ RAN revenues outside China grew for the third consecutive quarter in Q2 2025, reversing a two-year decline, according to Dell’Oro;
➁ Growth in Europe, the Middle East, and Africa nearly offset declines in the Caribbean, Latin America, and Asia Pacific;
➂ Huawei and Ericsson dominate regional markets (China and North America), with the global RAN vendor ranking led by Huawei, Ericsson, Nokia, ZTE, and Samsung, while long-term growth remains flat despite stabilization.
- Saxavord Spaceport appoints new CEO in wake of founder’s death
➀ Scott Hammond is appointed as the new CEO of Saxavord Spaceport following the death of co-founder Frank Strang;
➁ Debbie Strang becomes deputy CEO, and Mairi Prior joins as finance director, with the spaceport preparing for a test flight by RFA;
➂ Saxavord aims to become Europe's first vertical launch site, attracting companies like RFA, Skyrora, and Orbex for future missions.
- Ed’s Lèse-Majesté
➀ Ed's recommended AI system for UK government payments mistakenly halted the Sovereign Grant, citing multi-residence occupancy and probing sensitive palace affairs;
➁ The King demanded explanations; Ed appointed a CTO to resolve the crisis by clarifying AI hallucinations, which aligned with the monarch's AI concerns;
➂ The incident damaged Ed's political standing but ended humorously.
August 23
- Automotive buck converters for 48V rails
➀ Diodes introduced four automotive-grade buck converters (AP68255Q, AP68355Q, AP6A255Q, AP6A355Q) supporting 48V rails, with input voltages up to 100V and output currents of 2.5A or 3.5A;
➁ The asynchronous design uses external Schottky diodes and features a constant on-time control scheme (～300kHz) for fast transient response and low ripple, alongside EMI-reduction techniques and proprietary gate drivers;
➂ Qualified to AEC-Q100 Grade 1, the converters include protection mechanisms (over-current, over-temperature) and industrial-grade variants, targeting automotive and high-power applications.
August 22
- Foundries Squeeze Fabless
➀ Foundries are reducing investments despite 90% utilization, escalating tensions with fabless semiconductor companies;
➁ The semiconductor industry has achieved six consecutive years of double-digit unit growth, but lacks synchronized product cycles;
➂ Price control strategies by foundries and outsourcing trends in fab-lite companies may reshape industry dynamics.
- 1,500V 30mA photo-relay in 8x10mm package
➀ Toshiba launches TLX9161T, a 1,500V photo-relay in a compact 8x10mm package for EV batteries, with 1ms switching time;
➀ Features 30mA max current, 800Ω on-resistance, and 5kV isolation, targeting battery management and mechanical relay replacement;
➂ Compliant with AEC-Q101 Grade 1, 25% smaller than previous models while maintaining pin compatibility.
- GaN PSU dev board for solar racing cars
➀ Power Integrations offers a free GaN-based PSU development kit for solar racing car teams, featuring up to 95% efficiency and a heatsink-free design;
➁ The RDK-85SLR delivers 46W continuous and 80W peak power, using a 900V INN3990CQ IC and automotive-grade components;
➂ The kit includes schematics, PCB guides, and supports student teams like ETH Zurich's aCentauri in the Bridgestone World Solar Challenge.
- Most Read – Intel stake, Plessey Semi, AI Turing Institute
➀ Arm recruited Amazon's top IC developer Rami Sinno to develop proprietary AI chips, signaling increased investment in in-house semiconductor efforts;
➁ The smart glasses market surged 110% YoY in H1 2025, with Meta's Ray-Ban models dominating and Xiaomi/TCL-RayNeo expanding their foothold;
➂ The U.S. government plans to convert $10.9B in Chips Act grants into a 10% equity stake in Intel, while SoftBank invests $2B amid growing geopolitical semiconductor competition.
- Axelera AI in talks to raise $150m
➀ Dutch edge AI chip developer Axelera AI is seeking €150 million to advance its AI chiplet technology, targeting applications in robotics, automotive, and datacenters by 2028;
➁ The EU has supported Axelera with grants (€68 million) and investments, emphasizing its role in building Europe’s sovereign AI industry and reducing dependency on foreign chips;
➂ Axelera’s upcoming Titania chiplet utilizes proprietary Digital In-Memory Computing (D-IMC) and RISC-V architecture, with CEO Del Maffeo highlighting talent acquisition and competitive company culture as key drivers.