➀ Shenzhen Wanliyan Technology Co., Ltd., a subsidiary of New Kailai, has launched a new generation of ultra-high-speed real-time oscilloscope at the Bay Chip Exhibition, with a bandwidth突破90GHz.

➁ Oscilloscopes are essential tools in the development of technology-intensive industries such as electronics information, semiconductor, and integrated circuits, but the high-end oscilloscope market in China has been dominated by Western manufacturers like Tektronix, Keithley, and LeCroy, with Chinese manufacturers only able to provide mid-to-low-end products.

➂ The bandwidth of leading international high-end oscilloscopes reaches 60GHz or more, with the highest reaching 110GHz, while the highest bandwidth of domestic manufacturers' oscilloscopes was between 8GHz and 18GHz.

➀ Researchers at the University of Oxford demonstrated a method to link quantum computers using light-based quantum gate teleportation, achieving stable communication between two ion-based modules without physical connections;

➁ The setup used trapped ions (strontium for photonic communication and calcium for data processing) in vacuum chambers, with entangled photons enabling cross-module operations at 86.2% gate accuracy and 97% entanglement fidelity;

➂ Successful execution of Grover's search algorithm validated distributed quantum computing, highlighting a scalable approach for modular quantum systems through photonic entanglement.

➀ The 800V DC architecture is introduced to replace traditional 48V/12V systems in AI data centers, reducing energy losses and improving efficiency;

➁ Wide bandgap semiconductors like SiC and GaN enable compact, high-efficiency power solutions for next-gen AI infrastructure;

➂ Industry collaboration accelerates adoption of 800V designs to support multi-gigawatt AI data centers with enhanced sustainability.

➀ Littelfuse introduces the K5V4 illuminated tactile switch, the first reflow-compatible SPDT switch using high-temperature PAR material, streamlining surface-mount assembly;

➁ Features include gold-plated contacts, 4N actuation force, configurable SPDT functions, and integrated multi-color LEDs for enhanced user feedback;

➂ Targets industrial controls, data centers, and pro AV equipment with dust-resistant design and SMT/THT mounting options for high-volume manufacturing.

➀ The article introduces a book titled *How AI Thinks* by Nigel Toon, an expert with extensive experience in the electronics and AI industries;

➁ It positions the book as a valuable resource for technology enthusiasts and engineers exploring AI's development and applications;

➂ The author humorously notes reading a physical copy instead of adding it to a “virtual shelf” as usual.

➀ Nuvoton launched the Arbel NPCM8mnx SiP, a compact BMC subsystem integrating CPU, memory, storage, and power management into a 23x23mm chip, reducing development complexity for AI servers and datacenters;

➁ The SiP achieves a 70% size reduction, supports up to 4GB DDR4 and 64GB eMMC, and features post-quantum cryptography for security compliance;

➂ Designed for hyperscale deployments, it accelerates hardware development cycles and supports open standards like OpenBMC, with engineering samples currently available.

➀ Texas Instruments' TIDA-00431 integrates a 4 GSPS ADC and an 8 GHz DC-coupled differential amplifier, enabling direct RF signal capture up to 2 GHz bandwidth;

➁ Designed for radar, communication, and test systems, it eliminates traditional frequency translation stages to reduce latency and enhance signal fidelity;

➂ Includes full schematics, layout files, and TI component support (LMH5401 amplifier, ADC12J4000 converter) for streamlined high-performance receiver development.

➀ A new analog computing method integrates computation directly into resistive memory chips, eliminating data transfer bottlenecks between memory and processors;

➁ The system uses low-precision initial calculations followed by high-precision corrections, achieving 32-bit digital processor accuracy with 100x improved energy efficiency;

➂ Demonstrated 16×16 matrix processing in wireless communication tests, showing potential for 1,000x faster AI hardware at 100x lower energy consumption.

➀ Researchers at FH Dortmund aim to reduce energy losses in high-performance battery storage systems by increasing voltage levels tenfold to twentyfold, minimizing resistance-induced heat waste;

➁ A real-world lab in Ense will test 10,000–20,000V battery systems, analyze lifespan impacts, and develop insulation standards for medium-voltage DC applications;

➂ The modular high-voltage design eliminates active cooling, reduces maintenance, and enables scalable configurations, potentially revolutionizing energy storage efficiency and infrastructure.

➀ Broadcom and OpenAI partner to develop 6GW of custom AI accelerators, with OpenAI designing the chips and Broadcom handling development and deployment;

➀ The collaboration leverages Broadcom's Ethernet and connectivity solutions to build scalable AI infrastructure, supported by a long-term co-development agreement;

➂ Leaders from both companies emphasize the partnership's role in advancing AI capabilities, optimizing performance, and supporting OpenAI's mission to benefit humanity through artificial general intelligence (AGI).

➀ China's antitrust probe into Qualcomm's acquisition of Autotalks is seen as a strategic move in trade negotiations, despite the deal having cleared U.S. regulatory hurdles；

➁ China is ramping up mergers and acquisitions in Asia to secure supply chains, while struggling to match U.S. technological leads in AI hardware；

➂ Global economic dynamics are shifting toward multi-polar supply chains, with China reducing reliance on U.S. partnerships amid ongoing trade tensions

➀ The Dutch government assumed management control of Nexperia, a Chinese-owned semiconductor company, citing "serious governance shortcomings" and national security concerns;

➀ Authorities invoked the Goods Availability Act to intervene, enabling them to block or reverse company decisions for up to a year;

➂ The move followed asset disposals and personnel changes threatening critical technological capabilities, echoing prior UK actions demanding Nexperia divest a wafer fab in 2022.

➀ Melexis launched the MLX90514, a dual-input inductive sensor IC designed for automotive systems like steering torque feedback and steer-by-wire, enabling on-chip differential/vernier angle calculations;

➁ The integrated solution reduces system complexity by merging dual-channel processing, supports high-accuracy 24-bit data transmission, and eliminates the need for multiple ICs, lowering costs;

➂ Features include ASIL D compliance for safety, zero-latency synchronization, and compact design, making it ideal for electrified vehicles and advanced mobility applications.

➀ Imec challenges the perception that deep-tech investments yield only moderate returns, citing McKinsey and BCG data showing a 16% net annual IRR for deep-tech versus 10% for traditional tech with comparable failure rates;

➁ Despite high initial capital needs, deep-tech startups require less funding in later stages, face limited competition, and achieve higher profit margins due to disruptive market creation;

➂ Imec.DeepTechVentures reduces risks through semiconductor R&D expertise, global ecosystem integration, and manufacturing process optimization, accelerating commercialization of innovations like vertical AI compute architectures.

➀ The U.S. imposes 100% tariffs on Chinese goods and export controls on 'critical software' starting November 2025, escalating trade tensions following China's rare-earth export restrictions.

➁ China's new policy requires approval for exporting products with >0.1% rare-earth content, impacting global supply chains in automotive, electronics, and chip manufacturing.

➂ The undefined 'critical software' ban could target AI frameworks (e.g., PyTorch) and hardware control tools, further straining China's tech development and global industry operations.

➀ Russian semiconductor entrepreneurs avoid government funding due to mistrust and rely on foreign investment, fearing loss of control over their innovations;

➁ The government-backed Russian Electronics Corporation (REC) faces criticism for ineffective investment and lack of progress, despite ample national financial resources;

➂ Experts highlight Russia's need for external expertise and OEM industry development, with cautious optimism for a future fabless chip sector.

➀ China deploys customs enforcement teams to intercept NVIDIA AI chips (H20/RTX 6000D) at ports amid tightened U.S. export controls;

➁ Domestic tech giants like ByteDance face shipment disruptions as China expands scrutiny to all advanced semiconductors;

➂ Gray market's repurposed A100/H100 chips and domestic chip production bottlenecks create dual pressures on China's AI infrastructure.

➀ Researchers at the Technical University of Ulm (THU) developed CleanScreen, a UV-LED system integrated into touchscreens to automatically disinfect surfaces after each use, achieving 99.9% germ reduction in seconds;

➀ The system, funded by the German Federal Ministry for Economic Affairs and Energy, uses UVC and Far-UVC light (200-450 nm) and targets high-traffic public areas like hospitals and ATMs to enhance hygiene standards;

➂ The project received the UVLaunch Award from IUVA and the Senetics Innovation Award (2nd place) in healthcare, validating its potential for real-world applications.

➀ TSMC's September 2025 revenue reached $10.3 billion, a 31.4% year-on-year increase, though declining 1.4% month-on-month;

➁ Q3 2025 revenue totaled $32.47 billion, up 30% year-on-year;

➂ January-September 2025 cumulative revenue rose 36.4% year-on-year to $90.33 billion.

➀ Indian startup Atovio developed a wearable air purifier designed for India's extreme pollution, tested to reduce 90% of pollutants in 35 cubic feet;

➁ Features a Turbo Mode for AQI levels above 200, uniquely tailored to Indian conditions and locally manufactured in Haryana;

➂ Collaborates with academic institutions for clinical studies and plans real-time air quality tracking via a mobile app.