Recent #SRAM news in the semiconductor industry

10 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
10 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
10 months ago
➀ SureCore has developed a custom BGA package for cryogenic temperatures in partnership with Sarcina. This package is designed for extreme low temperature operations. ➁ SureCore aims to make Cryo-CMOS available for the Quantum Computing ecosystem with their CryoMem™ range of memory IP. ➂ The partnership will help QC companies design control/interface chips for cryogenic environments, improving the performance and scalability of quantum computers.
DesignQuantum ComputingSRAMsemiconductor
10 months ago
➀ TSMC unveiled details about its N2 (2nm-class) fabrication process at IEDM 2024; ➁ The new process promises a 24 to 35% power reduction or a 15% performance improvement at the same voltage; ➂ Key advancements include GAA nanosheet transistors and N2 NanoFlex design-technology co-optimization.
2nm processMicroelectronicsSRAMTSMCperformance improvementsemiconductor
12 months ago
➀ The story is about an ambitious startup that entered the DRAM, SRAM, E2PROM, and microprocessor markets; ➁ The company built two fabs and produced successful memories and a unique microprocessor that was not adopted by major applications; ➂ Despite spawning many startups that adopted its approach, the company could not survive independently and was taken over. The moral is that uniqueness can be a negative.
DRAMSRAMStartupsemiconductor
about 1 year ago
➀ The research on hybrid memory combines the density of DRAM with the speed of SRAM, receiving funding from CHIPS and the Science Act. The hybrid gain cell (HGC) memory research is one of the projects of the California-Pacific-Northwest AI Hardware Center, which will receive $16.3 million in funding from the U.S. Department of Defense. ➁ The team at Stanford University is developing an alternative memory design that combines the advantages of SRAM and DRAM. DRAM can store a large amount of data in a relatively small space, but its read speed is relatively slow. SRAM can read data faster, but its units are relatively large. The gain cell memory developed by the Stanford team combines the small space of DRAM and the almost as fast speed of SRAM. ➂ The mixed gain cell storage device overcomes limitations by combining silicon read transistors with indium tin oxide write transistors, achieving a bit retention time of over 5000 seconds and about 50 times faster than similar oxide-oxide gain cells.
DRAMSRAM
over 1 year ago
1. ARM has introduced a concept called High Bandwidth Instance (HBI) at the VLSI Symposium 2024, featuring an 8T 1R1RW SRAM design that allows for simultaneous read and write operations. 2. The HBI includes a DDATA memory that simplifies the design of the L1 Data Cache and offers a latency advantage of 10 to 15 ps. 3. ARM has tested a 3 nm chip with 112 SRAM-HBI macro cells, achieving speeds of up to 7.74 GHz at 0.945 V and 3.13 GHz at 0.495 V.
ArmHigh-Bandwidth-InstanceSRAM