➀ Waymo 筹集超过 250 亿美元；➁ Imec 扩大汽车芯片组；➂ 本年度及下一年半导体市场将实现两位数增长；➃ Charlie Sporck 逝世；➄ 英特尔宣布工艺技术发展部门的新负责人；

➀ Imec expands its auto chiplet group; ➁ Intel announces a new head of process technology development; ➃ Raspberry Pi releases a 26Top/s AI add-on board; ➄ Spire Global and OroraTech improve wildfire detection using space-based data and analytics.

➀ PhotonDelta is launching a contest in collaboration with Wevolver to develop applications for photonic chips that address global challenges; ➁ The contest is supported by a €60 million fund and aims to foster innovation in the PIC ecosystem; ➂ Winners will receive services worth €50,000 and a chance to raise a €2 million loan from PhotonDelta.

➀ The increasing demand for AI in optical modules requires high bandwidth, low power consumption, small size, and high-density packaging. ➁ Micro-ring modulators and multi-wavelength light sources are key technologies for miniaturization and low power consumption. ➂ IMEC's micro-ring modulator receiver has a typical energy consumption of 3.5pj/bit, aiming for <4pj/bit. ➃ Energy consumption of current 800G OSFP optical modules is ~18pj/bit, and using low-power LPO can reduce it to ~8pj/bit. ➄ The future goal is to achieve <1.5pj/bit by optimizing laser technology. ➅ Micro-rings are sensitive to wavelengths and can achieve dense wavelength division multiplexing, meeting AI's needs for small size, multi-channel, high capacity, and low energy consumption. ➆ IMEC's micro-ring modulator has a radius of 2.5μm and can multiplex 27 wavelengths.

➀ Apollo Global Management reportedly considering a $5 billion investment in Intel; ➁ Imec develops a cost-effective, manufacturable solid-state lithium battery; ➃ Q2 semiconductor revenue reaches a record $162bn, driven by Nvidia; ➄ ADI and Tata sign an MoU for semiconductor manufacturing in India; ➅ Elektra Awards 2024 finalists announced

➀ imec和13家欧洲合作伙伴共同开发出高性能锂金属固态电池；➁ 电池原型在EnergyVille的先进电池组装实验室制造，具有独特的“液态到固态”处理固态电解质；➂ 能量密度达到1070 Wh/L，远超目前锂离子电池的800 Wh/L；➃ 制造过程成本低，适用于现有锂离子电池生产线。

➀ Imec has released images of single-exposure patterns using ASML’s high-NA EUV scanner, showcasing logic structures down to a 9.5nm half-pitch. ➁ The patterns include 30nm center-to-center random vias and a DRAM-relevant pattern at P22nm pitch, demonstrating the readiness of the ecosystem for high-resolution EUV lithography. ➂ These patterns were created at the ASML-Imec High NA EUV Lithography Lab in Veldhoven, highlighting the potential of High NA EUV for single-print imaging of aggressively-scaled 2D features.

➀ Imec and ASML have successfully patterned sub-20nm pitch metal layers using High NA EUV lithography in a single exposure. ➁ The results demonstrate the capability of High NA EUV to enable dimensional scaling of logic and memory technologies. ➂ These achievements were made possible through the joint ASML-imec lab, accelerating the introduction of High NA lithography into manufacturing.

1. Imec has demonstrated silicon-based quantum dot spin qubit processing on 300mm wafers with low charge noise. 2. The technology is compatible with CMOS manufacturing and offers potential for large-scale quantum computers. 3. The research highlights the maturity of industrial fabrication techniques for qubit development.

1. Imec, UGent, and Belnet have realized the first Quantum Key Distribution (QKD) links in a 30-month project aiming to secure data transmission using quantum physics principles. 2. The project aims to establish a quantum-secure communication testbed in Belgium, allowing institutions to adapt to the future of digital communication. 3. The first QKD link connects two Ghent University campuses, while additional links serve the European Space Agency and Belnet for secure data transfer.

1. Efabless democratizes chip design for startups and academia; 2. Imec offers training for its 2nm PDK; 3. 402Tbit/s transmission achieved through advanced optical fiber technology; 4. European space companies sign contracts for LEO satellite platforms under ESA's Zero Debris standards.

1. imec is offering 2nm NanoIC pilot line and P-PDK training sessions. 2. The workshop focuses on making the P-PDK accessible to industry and academia. 3. Participants learn about system-technology co-optimization (STCO) and backside power delivery network (BSPDN) through hands-on training.

1. Imec unveiled two ADCs at the IEEE VLSI Symposium, designed for 'beyond 5G' communication, one for base stations and one for phones, both operating up to 5GHz. 2. The base station ADC is a 10Gsample/s CMOS hierarchical time-interleaved ADC with 9 ENOB at low frequencies and 8.2 ENOB at Nyquist, consuming 350mW. 3. The handset ADC uses a multi-bit pipelined architecture with background calibration, achieving 10.91 ENOB and 81dB SFDR at 1Gsample/s with 17.8mW consumption.

1. Imec has introduced a CMOS 56Gbit/s zero-IF D-band beam-forming transmitter at the IEEE RFIC Symposium. 2. The technology aims to support short-range wireless services above 100GHz, targeting applications in data centers, fixed wireless access, and extended reality. 3. The transmitter, operating between 120 and 145GHz, is part of a four-way beamforming transceiver chip under development.

1、imec和ASML共同开设了位于荷兰韦尔德霍芬的高NA EUV光刻实验室，以便为逻辑和存储器芯片制造商，以及材料和设备供应商提供访问第一个原型High NA EUV扫描仪的机会。 2、高NA EUV技术预计将在2025-2026年投入高volume制造。 3、该实验室为制造商和供应商提供了减少技术风险和开发私人High NA EUV用例的机会。