➀ David Manners reflects on a witty 65-year-old advertisement from Electronics Weekly's December 1960 edition;

➁ The article highlights Manners' four-decade experience in covering the electronics industry and its trends;

➂ It serves as a nostalgic look back at historical tech marketing and industry evolution.

➀ WSTS reports H1 2025 semiconductor market growth of 18.9% YoY, reaching €346 billion, driven by data center demand and early AI Edge applications;

➁ 2025 full-year forecast revised upward to €728 billion (15.4% growth), with logic and memory sectors expected to grow 29% and 17%, respectively;

➂ Geographically, the Americas and Asia Pacific lead expansion, Europe strengthens, while Japan faces a slight decline; 2026 growth projected at 9.9% to €800 billion.

➀ Simulation studies using SEMulator3D expose structural challenges in 3D NAND memory when layers exceed 300, with stress causing bending and collapse;

➁ Two DOE analyses identified that balancing silicon nitride (SiN) and oxide layer properties mitigates deformation, highlighting material optimization as key;

➂ Virtual testing offers a cost-effective method to explore designs and improve yield without physical fabrication.

➀ A severely damaged AMD Radeon RX 7800 XT, previously subjected to a failed DIY oven reflow attempt, was expertly repaired by Northwest Repairs through GPU core and VRAM reballing;

➁ Thermal imaging and memory tests revealed short circuits and faulty VRAM chips, requiring meticulous component replacement and pad repairs;

➂ The restoration highlights the technical mastery of professional repair services in salvaging high-end hardware, emphasizing sustainability and the value of skilled craftsmanship in DIY culture.

❶ Kioxia introduces 128GB, 256GB, and 1TB UFS 4.1 embedded flash memory for automotive applications, supporting up to 115°C; 512GB version to follow.

❷ Compliant with AEC-Q100/104 Grade 2 standards, targeting infotainment, ADAS, telematics, and vehicle computers.

❸ Delivers 2.1x sequential read, 2.5x write, and up to 3.7x random write improvements over UFS 3.1.

➀ The article lists the top ten fabless semiconductor companies in Q1 2025, based on data from research firm TrendForce;

➀ It highlights the rankings and market dynamics within the fabless industry, emphasizing the role of key players in driving semiconductor innovation;

➂ The analysis underscores trends such as AI demand, memory advancements, and high-performance computing (HPC) influencing the competitive landscape.

➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 7.4% YoY to $125.5B in 2025, with further growth to $138.1B in 2026 driven by logic, memory, and next-gen technologies;

➁ Wafer Fab Equipment (WFE) and backend segments (test, assembly/packaging) show strong growth, fueled by AI, HBM demand, and advanced nodes like 2nm GAA, though automotive/consumer sectors lag;

➂ Regional investments led by China, Taiwan, and Korea face trade policy risks, while NAND/DRAM rebounds highlight memory's role in AI infrastructure.

➀ Kioxia is sampling 512Gbit TLC flash memory using 9th-gen 3D technology, targeting mid-low capacity storage and enterprise SSDs for AI systems;

➁ Features 61% write/12% read performance gains, 36% write/27% read efficiency improvements, with 3.6Gbit/s Toggle DDR6.0 speeds;

➂ Targets IoT/automotive embedded systems, uses wafer-level bonding for CMOS-memory integration, commercial production planned FY2025.

➀ The G.Skill Trident Z5 Neo RGB DDR5-6000 C26 96GB kit delivers outstanding out-of-box performance and tight timings, optimized for AMD Ryzen systems.

➀ With 96GB (2x48GB) capacity and DDR5-6000 speeds, it excels in professional workloads and gaming, though it requires 1.45V voltage and offers limited overclocking headroom.

➂ Priced at $479.99, it’s a premium choice for users needing high-capacity RAM on dual-DIMM motherboards, despite its higher cost.

➀ CXMT delays mass production of DDR5 memory to late 2025 due to quality and yield challenges, with rates around 50% and resolved thermal issues through costly redesigns;

➁ The company's DDR5 quality now matches Nanya Technology, but global competitiveness is hampered by outdated 16nm process and U.S. export restrictions on equipment maintenance;

➂ China's state-backed expansion targets 280,000 wafers monthly by 2025, though reliance on foreign tools (80% imported) poses long-term risks amid geopolitical tensions.

➀ Researchers developed the world's first comparator-free memory sorting chip using memristor-based PIM architecture and Tree Node Skipping algorithm;

➁ The system achieved 7.7× speed improvement and 160.4× energy efficiency compared to ASIC solutions, enabling real-time applications;

➂ Demonstrated versatility in path planning and AI acceleration, paving the way for next-gen edge computing and intelligent hardware.

➀ G.Skill 与专业超频者 bl4ckdot 合作，刷新了 DDR5 内存频率的世界纪录；

➁ 新纪录为 12,872MHz，使用 G.Skill Trident Z5 DDR5 内存单条 24GB 模块，并采用液氮冷却；

➂ 该成就展示了 G.Skill 对内存超频性能的承诺，并在 HWBOT 领跑者榜单上领先于 Corsair 的 Vengeance RAM。

➀ The article highlights a 1960 Electronics Weekly advertisement celebrating the emergence of silicon transistors;

➁ It marks the 65th anniversary of this milestone in semiconductor technology development;

➂ The content reflects on historical advancements through the blog's "Memory Lane" series.

➀ G.Skill展示了在ASUS ROG Maximus Z890 Hero CAMM 2主板上运行的10,000MHz DDR5内存；

➁ CAMM2形式因具有更好的散热和信号完整性；

➂ G.Skill的64GB CAMM2模块在DDR5-10000 CL52下运行，并通过Memtest进行100%覆盖测试。

➀ IQE and Quinas Technology announced the completion of a £1.1m UltraRAM industrialisation project, developing scalable GaSb epitaxy for memory devices;

➁ ULTRARAM integrates non-volatility of flash storage with the speed and efficiency of DRAM, targeting AI, quantum computing, and space/defense applications;

➂ The project leveraged Innovate UK funding and IQE's industrial capabilities, advancing sovereign memory technology in the UK semiconductor sector.

➀ The article revisits a 1960 Electronics Weekly piece discussing historical technological advancements;

➁ It references the UK's former dominance in computers and business perspectives on the space program;

➂ Highlights the significance of GEC Semiconductors and reflects on past semiconductor industry developments.

➀ The Trump Organization plans to launch the T1, a $499 Android smartphone manufactured in the U.S., with production in Florida, Alabama, and California;

➁ The T1 features a 6.8-inch display, 12GB RAM, 256GB storage, a 50MP rear camera, and a 16MP front camera, marketed as part of the "America First" initiative;

➂ Despite skepticism about U.S. manufacturing feasibility, the phone will use Liberty Mobile Wireless network and cost $47.45/month, though early production may occur outside the U.S.

➀ Panmnesia, a Korean CXL specialist, launched a full-stack HPC system using CXL 3.x switches and IP, enabling flexible resource scaling and enhanced parallel computing performance;

➁ The composable hardware architecture allows independent scaling of compute and memory nodes via CXL switches, reducing costs by eliminating redundant resources;

➂ The software stack replaces network-based communication with CXL memory sharing, cutting latency by 44% in a fluid dynamics simulation demonstration.

➀ Memory Disc V3 is a coin-sized storage device designed by Barrelhand to archive human cultural data;

➁ It features advanced encoding and will be deposited on the Moon for long-term preservation;

➂ The project aims to serve as a future reference for human civilization beyond Earth.

➀ UK physicists at Loughborough University created the world's smallest platinum violin (13x35 microns) using nanolithography as a testbed for advanced memory device research;

➁ The team utilized a thermal scanning probe microscope to etch nanostructures, enabling progress in heat-sensitive storage and nanoscale magnetic sensors;

➂ This breakthrough highlights nanolithography's potential to extend traditional computing technologies amid slowing Moore's Law.