<p>➀ Simulation studies using SEMulator3D expose structural challenges in 3D NAND memory when layers exceed 300, with stress causing bending and collapse; </p><p>➁ Two DOE analyses identified that balancing silicon nitride (SiN) and oxide layer properties mitigates deformation, highlighting material optimization as key; </p><p>➂ Virtual testing offers a cost-effective method to explore designs and improve yield without physical fabrication.</p>