SemiVoice

➀ CXL consortium showcased advancements at FMS 2024, including new specifications and product demonstrations. ➁ SK hynix introduced a 128 GB CMM-DDR5 CXL memory module and a Heterogeneous Memory Software Development Kit (HMSDK). ➂ Marvell announced a new CXL product line, Structera, featuring compute accelerators and memory expansion controllers.

➀ Western Digital's Ultrastar DC SN861 SSDs use Fadu's FC5161 controller, a South Korean company specializing in enterprise SSD solutions. ➁ The FC5161 supports 16 NAND channels and offers advanced enterprise features like OCP Cloud Spec 2.0 and SR-IOV. ➂ The SN861 provides high-speed performance with sequential read speeds up to 13.7 GB/s and write speeds up to 7.5 GB/s, available in capacities from 1.6 TB to 7.68 TB.

➀ Intel sold its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. ➁ The company also exited its investment in ZeroFox and reduced its involvement with Astera Labs as part of a broader cost management strategy. ➂ Intel reported a $120 million net loss on its equity investments for the quarter, amidst significant financial challenges.

➀ AMD has launched the Ryzen 9 9950X and Ryzen 9 9900X, the remaining two models of the Ryzen 9000 series, featuring the latest Zen 5 architecture. ➁ The Ryzen 9 9950X boasts 16 Zen 5 cores and a boost clock up to 5.7 GHz, while the Ryzen 9 9900X has 12 Zen 5 cores with a boost clock up to 5.6 GHz. ➂ Despite a slight delay, all Ryzen 9000 series processors are now available, compatible with existing AM5 sockets and X670E/X670 motherboards.

➀ G.Skill has introduced ultra-low-latency DDR5-6400 memory modules with CL30 timings, the most aggressive yet for DDR5-6400 sticks. ➁ These modules are designed for both AMD and Intel systems, offering a significant reduction in latency compared to JEDEC standards. ➂ The new memory kits will be available starting late August 2024, targeting high-end motherboards and properly cooled CPUs.

➀ Kioxia demonstrated an optical interface SSD at FMS, developed with funding from NEDO to reduce data center power consumption by up to 40%. ➁ The optical interface allows for data transfer over long distances, enabling storage to be kept in separate rooms with minimal cooling requirements. ➂ The demonstration showed a slight loss in IOPS performance but significant latency advantages over traditional copper network links.

➀ Silicon Motion demonstrated the flexibility of their MonTitan Gen 5 Enterprise SSD Platform at FMS 2024, showcasing its ability to optimize data placement for AI data pipelines. ➁ The platform utilizes the NVM Express standard's Flexible Data Placement (FDP) feature to reduce write amplification and improve performance. ➂ Silicon Motion's approach allows for customization and flexibility, appealing to flash array vendors and differentiating from competitors like Phison.

➀ Kioxia demonstrated a new RAID offload methodology for enterprise SSDs at FMS 2024, aiming to address performance scaling issues in RAID arrays. ➁ The proposed solution utilizes PCIe direct memory access and the SSD controller's memory buffer (CMB) to avoid data movement to the CPU. ➂ The PoC showed significant reductions in CPU and system DRAM utilization, and Kioxia plans to contribute this feature to the NVM Express working group for potential standardization.

➀ Western Digital introduces 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and two 16 TB external SSDs. ➁ All products utilize BiCS8 QLC NAND technology. ➂ The 16 TB external SSDs include a SanDisk Desk Drive and a SanDisk Extreme Pro model, with the latter being a technology demonstration.

➀ The Noctua NH-D15 G2 LBC cooler is a high-performance option for PC enthusiasts, known for its exceptional build quality and cooling efficiency. ➁ Priced at $150, it offers the best performance currently achievable by an air cooler. ➂ Available in three versions, it caters to specific CPU needs with variants designed for AMD AM5 and Intel LGA1700 processors, while the standard version focuses on long-term compatibility.

➀ Kioxia showcased its BiCS 8 3D NAND technology at FMS 2024, featuring 218 layers and a new CMOS Bonded Array (CBA) process. ➁ The CBA process allows independent parallel processing of CMOS wafer and cell array wafer, improving reliability and performance. ➂ Despite fewer layers compared to competitors, Kioxia's lateral scaling enables competitive bit density and operating speeds.

➀ Western Digital showcased their upcoming PCIe 5.0 x4 M.2 2280 NVMe SSDs at FMS 2024, targeting mobile workstations and consumer desktops. ➁ The company demonstrated two versions: a performance segment drive with an 8-channel controller and a mainstream version with a 4-channel DRAM-less controller, both using BiCS8 218-layer 3D TLC. ➂ Western Digital emphasized the power efficiency of their platform, promising low power consumption under stressful traffic, making it suitable for both mobile workstations and desktops.

➀ AMD is offering a new gaming bundle featuring Warhammer 40,000: Space Marine 2 and Unknown 9: Awakening with the purchase of select Ryzen 7000 CPUs and Radeon RX 7000 video cards. ➁ The bundle includes both desktop and laptop hardware, excluding the upcoming Ryzen 9000 series. ➂ The promotion is available through participating retailers in the U.S. and Canada, starting August 6, 2024, and ending October 5, 2024.

➀ Western Digital has teased a 128 TB SSD using BiCS8 QLC NAND, designed for AI data lakes and capacity-intensive applications. ➁ The BiCS8 NAND features 218 layers and a hybrid bonding scheme, suitable for Gen 4+ drives. ➂ The SSD's firmware is optimized for AI checkpointing, supporting sequential writes and simultaneous read operations.

➀ AMD has launched the Ryzen 7 9700X and Ryzen 5 9600X, mid-range desktop processors featuring the Zen 5 microarchitecture. ➁ Both processors offer high boost clock speeds, with the Ryzen 7 9700X reaching up to 5.5 GHz and the Ryzen 5 9600X up to 5.4 GHz. ➂ The Ryzen 9000 series uses the same AM5 socket as its predecessor, allowing for compatibility with existing motherboards after a firmware update.

➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.

1. Western Digital has announced the sampling of a 32TB hard drive using EAMR and SMR technologies, targeting hyperscalers. 2. The drive incorporates advanced technologies such as ePMR, triple-stage actuators, OptiNAND, and UltraSMR for enhanced capacity and reliability. 3. This move brings Western Digital's capacity on par with Seagate's 30TB Exos HDDs, although Seagate still leads in areal density.

1. The ECS LIVA Z5 PLUS mini-PC is designed for business and industrial use-cases, fitting between the ultra-compact form-factor and industrial-oriented 3.5" SBC. 2. It features an Intel U series processor with a slightly increased configurable TDP compared to the standard 15W operating point. 3. The review covers the performance and features of the ECS LIVA Z5 PLUS, highlighting the advantages of its slightly larger form-factor.

1. Intel has extended the warranty period for its 13th and 14th Gen Core retail CPUs by two years due to chip instability issues. 2. The extended warranty aims to address ongoing stability issues with desktop Raptor Lake chips and provides a total warranty period of five years. 3. The extended warranty only applies to boxed processors, not tray processors sold to OEMs and certain distributors.

1. Intel is facing yield issues with its Meteor Lake chips, leading to short supply. 2. The company has resorted to running 'hot lots' to expedite production and meet demand. 3. Despite the challenges, Intel has shipped 15 million AI PC chips since the launch of Meteor Lake.

1. Intel plans to cut $10 billion in costs by 2025, including a 15% workforce reduction affecting 15,000 employees. 2. The company aims to reduce spending on R&D, marketing, administration, and capital expenditures. 3. Intel will also simplify its product portfolio and suspend its dividend to focus on core competencies and regain profitability.

1. Micron has started shipping its 9th Generation 276-layer TLC NAND, offering significant improvements in density and performance. 2. The new NAND features a 44% increase in density over the previous generation and supports transfer rates up to 3600 MT/sec. 3. Micron's 2650 client SSD is the first product to utilize this new NAND technology, providing high-speed storage solutions for various applications.

1. Cooler Master's V Platinum 1600 V2 is a high-capacity ATX 3.1 power supply designed for high-end gaming and workstation PCs. 2. Despite its 1600 Watt output and numerous features, it targets budget-conscious users who need a powerful and efficient PSU. 3. The review will explore how Cooler Master manages to offer a competitive product with a more modest bill of materials.

1. Intel's next-generation Core Ultra laptop chips, codenamed Lunar Lake, are set to launch on September 3rd. 2. Lunar Lake is designed for ultrabooks and low-power mobile devices, featuring significant efficiency advancements. 3. The chips incorporate updated architectures, including Lion Cove and Skymont cores, Xe2 GPU, and 4th generation NPU, with both chiplets manufactured by TSMC.

1. AMD introduces the Zen 5 microarchitecture and RDNA 3.5 graphics in their new mobile SoC, Strix Point. 2. The new SoC includes an upgraded XDNA 2-based NPU offering up to 50 TOPS of performance. 3. AMD's Ryzen AI 300 series targets the active notebook market, with the Ryzen AI 9 HX 370 featuring a mix of Zen 5 and Zen 5c cores.

1. ASRock introduces passively cooled Radeon RX 7900 XTX and XT cards for server use, addressing the high cost of official server cards. 2. These cards feature a dual-slot heatsink without fans, designed for high-airflow forced-air cooling, and are equipped with a 12V-2×6 power connector. 3. With 24GB and 20GB of memory respectively, these cards are targeted at memory-intensive AI applications, offering a cost-effective solution compared to high-end professional cards.

1. SK hynix plans to release a 60 TB SSD next quarter, entering the ultra-premium enterprise SSD market. 2. The company expects eSSD sales to quadruple compared to last year. 3. SK hynix has options to use its own or Solidigm's controllers for the new SSD.

1. AMD has delayed the launch of its Ryzen 9000 series desktop processors by one to two weeks due to quality issues with the initial production units. 2. The launch will now be staggered, with the Ryzen 5 9600X and Ryzen 7 9700X launching on August 8th, and the Ryzen 9 9900X and Ryzen 9 9950X on August 15th. 3. The delay is also due to AMD needing to recall and replace the first batch of chips sent to distributors.

1. Micron introduces the 9550 series SSDs, claiming they are the fastest enterprise drives with up to 14 GB/s read speeds. 2. The drives feature a PCIe 5.0 x4 interface and 232-layer 3D TLC NAND, available in various capacities and form factors. 3. Micron emphasizes the power efficiency of the 9550 SSDs, claiming up to 81% less energy per terabyte transferred compared to competitors.

1. JEDEC is developing standards for DDR5 MRDIMMs and LPDDR6-based CAMMs. 2. MRDIMMs aim to double peak bandwidth to 12.8 Gbps and support more than two ranks. 3. LPDDR6 CAMMs will feature a new connector array to accommodate wider memory bus requirements.