Intel has reached a significant milestone with the first production run of 18A (1.8nm-class) wafers at its Arizona fabrication facility. This development comes amidst the broader market attention on the appointment of Lip-Bu Tan as Intel's new CEO. The Arizona fabs, including Fab 52 and Fab 62, are high-volume production sites, making the operation of the 18A fabs a major achievement for the company.

In a LinkedIn post, Pankaj Marria, an engineering manager at Intel, highlighted the team's pride in being part of the 'Eagle Team' that led the way in bringing Intel's 18A technology to life. The initial lots were processed in Arizona, marking a crucial step in advancing cutting-edge semiconductor manufacturing.

Intel's 18A technology is a pivotal advancement for the company, relying on gate-all-around RibbonFET transistors to enhance performance, reduce power consumption, and feature backside power delivery. This technology is set to be used for mass-producing compute chiplets for the upcoming Panther Lake processors and the Xeon 7 processors for datacenters.

Marria expressed his confidence in the team's hard work, innovation, and dedication, emphasizing that this is just the beginning of their journey. The achievement is a testament to the development and manufacturing capabilities of Intel in the United States.