<p>➀ The PUNCH project, coordinated by IMEC and led by Fraunhofer IZM, aims to develop optical switches to accelerate data networks, achieving 8x faster transmission than conventional methods for applications in data centers and traffic networks;</p><p>➁ Researchers integrate photonic integrated circuits (PICs) with electronic chips using heterogenous Fan-Out Wafer Level Packaging (FOWLP), boosting network speeds to 1.6 Tb/s and improving scalability for mass production;</p><p>➂ The technology promises reduced latency, lower energy consumption, and guaranteed service quality, with potential use cases in automotive communication and video streaming.</p>