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electronicsweekly

09/25/2024, 01:27 PM UTC

意法半导体与瑞萨电子合作提升碳化硅产量和生产效率Soitec and Resonac hook up to improve SiC yield and productivity

➀ 意法半导体与瑞萨电子合作，利用瑞萨电子的衬底和外延工艺共同开发200mm SmartSiC晶圆；➁ 合作旨在提升碳化硅的产量和生产效率；➂ 意法半导体的SmartSiC晶圆采用公司专有的SmartCut技术生产。➀ Soitec and Resonac are collaborating to co-develop 200mm SmartSiC wafers using Resonac's substrates and epitaxy processes; ➁ The partnership aims to improve SiC yield and productivity; ➂ Soitec's SmartSiC wafers are produced using the company's proprietary SmartCut technology.

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