04/17/2025, 12:06 PM UTC
热边公司推出下一代半导体制造先进ALD系统Thermic Edge Launches Advanced ALD System for Next-Generation Semiconductor Manufacturing
热边公司自豪地推出了其新型原子层沉积（ALD）系统，旨在加速二维材料在下一代半导体器件中的应用。该系统结合了单室ALD和高温退火，降低了污染风险并提高了工艺效率。它支持8英寸的晶圆级加工，确保在大面积基板上均匀沉积。系统具备喷头式气体输送系统以实现均匀气体分布、精确温度控制和氧化、硫化物、氮化物的多气体兼容性。
Thermic Edge Ltd proudly introduces its new Atomic Layer Deposition (ALD) System, designed to accelerate the integration of 2D materials into next-generation semiconductor devices. The system combines single-chamber ALD and high-temperature annealing, reducing contamination risks and improving process efficiency. It supports wafer-scale processing up to 8 inches and ensures uniform deposition across large-area substrates. The system features a showerhead gas delivery system for uniform gas distribution, precise temperature control, and multi-gas compatibility for oxide, sulfide, and nitride processing.
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