09/28/2024, 10:37 AM UTC
芯片产业一周综述Chip Industry Week In Review
➀ 2025年至2027年，300mm晶圆厂设备全球支出预计将达到4000亿美元；➁ 拜登-哈里斯政府启动了国家半导体技术中心的人才卓越中心，投资2.5亿美元；➂ 台积电与EDA公司 扩展了合作，包括AI驱动工具和先进封装技术的开发；➃ 高通正在考虑对英特尔提出收购要约；➄ 美国政府向极地半导体公司拨款1.23亿美元，用于传感器和功率半导体；➅ JEDEC发布了两个新的CXL标准，MIPI联盟宣布了MIPI A-PHY v2.0；➆ SK海力士开始批量生产首款12层，36GB的HBM3E；➇ 谷歌DeepMind公布了其AI设计芯片布局的方法，AlphaChip。➀ Global spending on 300mm fab equipment is expected to reach $400 billion from 2025 to 2027; ➁ The Biden-Harris Administration launched the National Semiconductor Technology Center’s Workforce Center of Excellence with $250 million investment; ➂ TSMC extended partnerships with EDA companies for AI-driven tools and advanced packaging technologies; ➃ Qualcomm is considering making an offer for Intel; ➄ The U.S. government awarded $123 million to Polar Semiconductor for sensor and power semiconductors; ➅ JEDEC published two new CXL standards and MIPI Alliance announced MIPI A-PHY v2.0; ➆ SK hynix started mass producing the first 12-layer, 36GB HBM3E; ➇ Google DeepMind released details on its AI method for designing chip layouts, AlphaChip.
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