➀ The European Semiconductor Industry Association (ESIA) is requesting a second Chips Act without accounting for the outcomes of the first one, which failed to boost EU chip production to 20% of the global market. ➁ The only proposed initiative for leading-edge chip manufacturing in Europe, Intel at Magdeburg, seems increasingly unlikely. ➂ ESIA is asking for a chip envoy, reduced export restrictions, and quicker distribution of aid, indicating a preference for continuous financial support without tangible deliverables.

➀ Amkor, a Korean OSAT specialist, has received $400 million under the US Chips Act and a loan of up to $200 million to build a $2 billion test and packaging plant in Peoria, Arizona. ➁ The US Department of Commerce highlights the importance of Amkor's 2.5D technology for AI and high-performance computing applications. ➂ The funding aims to enhance supply chain security, create jobs, and position the US as a leader in innovation and competition.

➀ The US CHIPS Act, despite attracting over $395 billion and creating 115,000 jobs, faces significant delays in nearly 40% of its major projects. ➁ Market conditions and political uncertainties, including the upcoming US elections, are cited as primary reasons for project delays. ➂ Key companies like TSMC, Intel, and GlobalFoundries are among those facing challenges, despite receiving substantial subsidies.

➀ TI has been awarded $1.6 billion in Chips Act funding and a $3 billion loan with a 25% tax credit for infrastructure investments. ➁ The funds will support TI's $18 billion investment in fabs, split across three projects in two locations. ➂ In Sherman, Texas, two new 300-mm fabs for 65nm-130nm chips, and in Lehi, Utah, a new 300-mm fab for 28nm-65nm analogue and embedded processing chips.

❶ Amkor Technology has secured a preliminary agreement with the U.S. government for $600 million in funding to build an advanced chip packaging facility in Peoria, Arizona. ❷ The $2 billion facility, the largest of its kind in the U.S., will support automotive, high-performance computing, and mobile applications. ❸ The project is expected to create around 2,000 jobs and is part of the broader effort to strengthen the domestic semiconductor supply chain.

1. The CHIPS Act is influencing semiconductor manufacturing in the U.S.; 2. Foundries and fabless firms face challenges to boost production; 3. The act aims to revitalize the semiconductor industry in the country.

❶ The US government has announced the first recipients of the CHIPS and Science Act funding, awarding $300 million to three R&D facilities. ❷ These facilities include an NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility, an NSTC Administrative and Design Facility, and an NSTC Extreme Ultraviolet (EUV) Center. ❸ The funding aims to bridge the gap between research and industry, revitalizing semiconductor R&D and addressing critical gaps in the current ecosystem.

1. The U.S. Department of Commerce announced a $1.6 billion competition for semiconductor advanced packaging R&D projects; 2. The funding will support five R&D areas including equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA; 3. This initiative aims to strengthen the U.S. semiconductor ecosystem and address strategic vulnerabilities in advanced packaging.

1. Rogue Valley Microdevices, an Oregon-based MEMS foundry, has received $6.7 million in Chips Act funding for its 300mm fab construction in Florida. 2. The company claims to be the first pure-play MEMS foundry with 300mm capability. 3. RVM offers a full-service precision MEMS foundry, specializing in MEMS and sensors manufacturing, including microfluidics and lab-on-chip platforms.

1. Entegris, a global leader in advanced materials science, and the U.S. Department of Commerce have announced a proposal for up to $75 million in direct funding under the CHIPS Act. 2. The funding aims to support the manufacturing of critical semiconductor products in Colorado Springs. 3. This initiative is part of efforts to strengthen U.S. semiconductor manufacturing capabilities.

1、美国商务部在CHIPS法案下与Absolics签订了7500万美元的协议，用于支持佐治亚州的玻璃基板制造facility。 2、该facility将创建1000个建筑工人和200个制造和R&D工作岗位，并增强佐治亚理工学院的创新能力。 3、Absolics的玻璃基板可以降低power consumption和复杂度，使计算更快、更高效。