07/11/2024, 11:18 PM UTC
16亿美元竞赛旨在支持先进封装项目$1.6B competition aims to aid advanced packaging projects
1、美国商务部宣布了一项16亿美元的竞赛，用于半导体先进封装研发项目；2、资金将支持五个研发领域，包括设备、电力输送、连接器技术、小芯片生态系统和协同设计/电子设计自动化；3、此举旨在加强美国半导体生态系统，并解决先进封装中的战略弱点。1. The U.S. Department of Commerce announced a $1.6 billion competition for semiconductor advanced packaging R&D projects; 2. The funding will support five R&D areas including equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA; 3. This initiative aims to strengthen the U.S. semiconductor ecosystem and address strategic vulnerabilities in advanced packaging.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
