08/16/2024, 05:40 PM UTC
TI 获得 46 亿美元芯片法案资金TI gets $4.6bn in Chips Act funding
➀ TI 获得了 16 亿美元的芯片法案资金和 30 亿美元的贷款，并享有基础设施投资的 25% 税收抵免。➁ 这些资金将支持 TI 在两个地点的三个项目中，共 180 亿美元的投资。➂ 在德克萨斯州谢尔曼，建设两个新的 300 毫米晶圆厂，生产 65nm-130nm 芯片；在犹他州莱希，建设一个新的 300 毫米晶圆厂，生产 28nm-65nm 模拟和嵌入式处理芯片。➀ TI has been awarded $1.6 billion in Chips Act funding and a $3 billion loan with a 25% tax credit for infrastructure investments. ➁ The funds will support TI's $18 billion investment in fabs, split across three projects in two locations. ➂ In Sherman, Texas, two new 300-mm fabs for 65nm-130nm chips, and in Lehi, Utah, a new 300-mm fab for 28nm-65nm analogue and embedded processing chips.
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