02/19/2025, 12:20 PM UTC
FOPLP来袭，CoWoS压力大增CoWoS Under Pressure as FOPLP Emerges
<p>➀ CoWoS的崛起为台积电带来了巨额营收，同时也威胁到了日月光和安靠等领先的封装工厂。</p><p>➁ 台积电第一季度的财报预测显示，先进封装的比重有所提升，消除了外界对CoWoS需求下降的担忧。</p><p>➂ 台积电计划增加CoWoS产能以满足客户需求，预计2025年，CoWoS的全年营收贡献将从2024年的8%增长至10%。</p><p>➃ 新兴的FOPLP封装技术提供了更高的I/O密度、更好的电性能和更大的封装尺寸，对CoWoS构成了挑战。</p><p>➄ FOPLP市场预计在未来五年将显著增长，预计复合年增长率为32.5%。</p><p>➅ 台积电、三星和群创等主要厂商都在积极开发FOPLP技术。</p><p>➆ FOPLP面临的挑战包括实现高良率和建立标准。</p><p>➀ The rise of CoWoS has brought significant revenue to TSMC, threatening leading packaging factories like ASE and Amkor.</p><p>➁ TSMC's Q1 earnings forecast indicates an increase in advanced packaging, dispelling concerns about decreasing CoWoS demand.</p><p>➂ TSMC plans to increase CoWoS capacity to meet customer demand, with expected revenue contribution growing from 8% in 2024 to 10% in 2025.</p><p>➃ FOPLP, a new packaging technology, offers higher I/O density, better electrical performance, and larger packaging sizes, challenging the dominance of CoWoS.</p><p>➄ FOPLP's market is expected to grow significantly, with a projected CAGR of 32.5% over the next five years.</p><p>➅ Major players like TSMC, Samsung, and AU Optronics are actively involved in FOPLP development.</p><p>➆ Challenges for FOPLP include achieving high yields and establishing standards.</p>
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