10/29/2024, 03:15 AM UTC
台积电与南亚科技公布台湾新先进制程及CoWoS封装扩展计划[New] TSMC and SPIL Unveil New Advanced Node and CoWoS Expansion Efforts in Taiwan
➀ 台积电与南亚科技正在台湾提升其半导体 制造能力；➁ 高雄的新2nm晶圆厂将是这些努力的关键设施；➂ 扩展重点在于先进制程和CoWoS封装技术。➀ TSMC and SPIL are advancing their semiconductor manufacturing capabilities in Taiwan; ➁ The new 2nm fab in Kaohsiung will be a key facility for these efforts; ➂ The expansion focuses on advanced node and CoWoS packaging technologies.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
