12/04/2024, 02:47 PM UTC
具有超细1.5μm铜线路的有机基板Organic Interposers With Ultra Fine 1.5μm Copper Circuits
➀ 日本Resonac公司推出适用于先进半导体封装的光敏薄膜；➁ 该薄膜能够在有机基板上实现1.5μm的线路宽度和间距；➂ 这项创新支持半导体封装的微型化和效率。➀ Resonac Corporation introduces a photosensitive film for advanced semiconductor packaging; ➁ The film enables 1.5μm line width and spacing on organic interposers; ➂ The innovation supports miniaturization and efficiency in semiconductor packaging.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
