01/03/2025, 08:48 AM UTC
支持创新与半导体封装新趋势——来自汉高粘合技术公司的拉姆·特里丘尔“Our Focus Is On Supporting Innovation And The New Trends In Semiconductor Packaging” – Ram Trichur From Henkel Adhesive Technologies
➀ 汉高粘合技术公司专注于支持半导体封装领域的创新；➁ 全球市场和战略总监拉姆·特里丘尔讨论了芯片封装的最新趋势；➂ 公司在印度投资建立了一个用于电子产品开发的应⽤工程中心。➀ Henkel Adhesive Technologies is focusing on supporting innovation in semiconductor packaging; ➁ Global market and strategy director Ram Trichur discusses the latest trends in chip packaging; ➂ The company is investing in India to establish an applications engineering center for electronics development.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
