10/21/2024, 04:53 PM UTC
台积电CoWoS产能两年翻倍，仍供不应求——供应商前景乐观TSMC's CoWoS Capacity Doubles for Two Years, Still Insufficient—Positive Outlook for Suppliers
<p>➀ 台积电的CoWoS产 能将在2024年和2025年翻倍，但需求将继续超过供应；</p><p>➁ 预计CoWoS扩张浪潮将持续到2026年，未来两年到三年内将惠及设备供应商；</p><p>➂ 先进封装目前占台积电收入的7-9%，预计未来五年内的增长将超过公司平均水平；</p><p>➃ 台积电的CoWoS月产能预计今年将达到3.5万到4万片，明年将增至每月8万片；</p><p>➄ 来自主要AI客户的强劲需求正在推动产能需求，预计到2026年，月产能可能达到14万到15万片。</p><p>➀ TSMC's CoWoS capacity will double in 2024 and 2025, but demand will continue to exceed supply;</p><p>➁ The CoWoS expansion wave is expected to extend into 2026, benefiting equipment suppliers for the next two to three years;</p><p>➂ Advanced packaging currently accounts for 7-9% of TSMC's revenue, with expected growth to outpace the company's average over the next five years;</p><p>➃ TSMC's CoWoS monthly production capacity is expected to reach 35,000 to 40,000 wafers this year, and surge to 80,000 wafers per month next year;</p><p>➄ Strong demand from major AI customers is driving capacity needs, potentially reaching 140,000 to 150,000 wafers per month by 2026.</p>
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