02/21/2025, 09:12 AM UTC
应用材料展示新的eBeam系统用于芯片缺陷检测Applied Materials showcases new eBeam System for chip defect detection
应用材料公司于周四展示了其新的检查套件SEMVision H20，该设备配备了公司第二代冷融合发射（CFE）技术，分析速度比热融合发射（TFE）设备快三倍。
Applied Materials demonstrated its new inspection kit SEMVision H20 on Thursday, equipped with the company's second-generation cold fusion emission (CFE) technology, which is three times faster than thermal fusion emission (TFE) equipment for analysis.
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