<p>➀ In 2011, Intel announced plans for a 450mm wafer pilot line by 2015, targeting test wafers in 2012 and equipment readiness by 2013; </p><p>➁ Developing 450mm fab equipment was estimated to cost $20 billion, with unclear funding sources and a pending EU proposal; </p><p>➂ Only Intel, Toshiba, TSMC, and Samsung were deemed financially capable of adopting 450mm fabs at the time, amid skepticism about Intel's execution capabilities.</p>