06/25/2025, 05:27 AM UTC
英特尔位居Foundry 2.0领域第二位Intel No.2 for Foundry 2.0
➀ Counterpoint Research报告显示，若将封装和掩模制造纳入晶圆代工（Foundry 2.0）市场定义，台积电以35%份额位居第一，英特尔以6.5%位列第二；
➁ 该定义或缓解台积电因传统晶圆代工市占率近70%引发的垄断担忧，ASE（6.2%）和三星（5.9%）分列第三、四位；
➂ 2025年Q1 Foundry 2.0市场规模达720亿美元，远超传统定义的364亿美元，英特尔季度份额增长0.6%，但同比下滑0.3%。
➀ Counterpoint Research's analysis defines Foundry 2.0 as encompassing packaging and mask-making alongside wafer fabrication, with TSMC leading at 35% market share and Intel ranking second at 6.5%;
➁ The expanded definition may mitigate monopoly concerns for TSMC, whose traditional wafer fabbing dominance reaches nearly 70%;
➂ The Foundry 2.0 market reached $72 billion in Q1 2025, with Intel gaining 0.6% quarterly market share but declining 0.3% year-over-year.
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