06/16/2025, 04:50 AM UTC
台积电SoIC需求激增，引发OSAT厂商扩产竞赛SPYI: An Ideal Options Income Fund
1、台积电SoIC先进封装技术因AI芯片和高效能运算需求激增面临产能挑战；2、日月光、Amkor等OSAT大厂加速扩产CoWoS和晶圆级封装产能；3、供应链设备交期延长至18-20个月，引发行业生态链协同合作应对瓶颈。1. TSMC's SoIC advanced packaging technology faces explosive demand driven by AI chips and HPC applications; 2. Major OSAT companies like ASE and Amkor are accelerating capacity expansion, particularly for CoWoS and chip-on-wafer packaging; 3. The supply chain faces bottlenecks as equipment delivery times extend to 18-20 months, prompting strategic collaborations across the ecosystem.---
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