10/21/2024, 11:06 AM UTC
台积电跃升全球最大封装厂？TSMC Surging to Become the World's Largest Packaging Factory?
<p>➀ 台积电是半导体行业的领头羊。</p><p>➁ 先进封装正成为提升芯片性能的关键技术路径。</p><p>➂ 随着Chiplet架构的快速采用，台积电有望成为最大的封装服务提供商。</p><p>➃ 台积电在先进封装技术上的投资巨大，产能预计将显著增长。</p><p>➄ 台积电的CoWoS、InFO和SoIC技术推动了公司在先进封装领域的领导地位。</p><p>➅ 台积电正在扩大产能以满足对先进封装不断增长的需求。</p><p>➆ 台积电还在投资光学封装技术以满足不断增长的带宽需求。</p><p>➀ TSMC is the leading player in the semiconductor industry.</p><p>➁ Advanced packaging is becoming a key technology path for chip performance improvement.</p><p>➂ TSMC is expected to become the largest packaging service provider with the rapid adoption of Chiplet architecture.</p><p>➃ TSMC has invested heavily in advanced packaging technology, with capacity set to grow significantly.</p><p>➄ TSMC's CoWoS, InFO, and SoIC technologies are driving the company's leadership in advanced packaging.</p><p>➅ TSMC is expanding its capacity to meet the increasing demand for advanced packaging.</p><p>➆ TSMC is also investing in optical packaging technology to meet the growing bandwidth needs.</p>
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