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October 31
- Semiconductor Device Simulation Resources and Techniques
Unknown
➀ Overview of various semiconductor device simulations including diodes, transistors, and power devices;
➁ Detailed explanations of simulation software like Svisual, Sde, Sdevice, and their applications in device and circuit simulations;
➂ Special focus on emerging technologies like SiC, GaN, and Ga2O3 devices and their simulation techniques;
➃ Discussion on ESD, BJT, and tunneling device simulations;
➄ Coverage of TCAD simulations, film transistors, and magnetic materials devices;
➅ Additional resources on virtual machine usage and ISPSD 2024 papers.
- Salary Survey of the Most Popular Fab Factories for Fresh Graduates!
IC Circle
➀ SMIC offers salaries ranging from 20-25w RMB annually for fresh graduates in various positions such as design, PDK, process, and device engineering, with the highest reaching 40-50w RMB;
➁ Hua Hong Semiconductor offers salaries around 16-20w RMB annually, with a relatively relaxed work environment and less overtime;
➂ TSMC offers a uniform annual salary of 13k*18 for fresh graduates in production roles;
➃ Jishata Semiconductor offers salaries between 17w-24w RMB annually for device and process positions;
➄ Goke Semiconductor offers an annual salary of about 18w RMB, with overtime pay potentially reaching 27w RMB;
➅ Shanghai Integrated Circuit Research and Development Center offers salaries of 13-16k RMB monthly;
➆ Ding Tai Jinxin offers an annual salary of about 20w RMB;
➇ Xinwei Semiconductor offers salaries of about 18w-25w RMB for manufacturing positions;
➈ SK hynix offers salaries of 6000 RMB for bachelor's degrees and about 1w RMB for master's degrees, with 14-18 months of pay;
➉华润微电子 offers salaries of 8k-1w RMB for master's degrees with 2-3 months of year-end bonus, totaling about 15-17w RMB annually.
- Hua Run Wei's Third Quarter Revenue Grows 8.44% Year-on-Year
Hua Run Wei Official Account
➀ Revenue of Hua Run Wei grew by 8.44% year-on-year in the third quarter of 2024;
➁ The company's revenue for the first three quarters reached 7.472 billion yuan;
➂ Hua Run Wei increased its research and development investment to 8.89 billion yuan in the first three quarters, up by 2.28 percentage points year-on-year;
➃ The project 'Power MOSFET & High Voltage Integrated Chip Key Technologies and Applications' led by Hua Run Wei won the 2023 National Science and Technology Progress Award;
➄ The global semiconductor industry is recovering, with sales reaching 1.499 trillion yuan in the second quarter of 2024;
➅ Hua Run Wei is driving diversified development with a focus on high-end applications such as automotive electronics and industrial control;
➆ The company expects to move towards the high-end of the industry chain and value chain with its deep accumulation and continuous innovation in high-end application fields such as new energy, automotive electronics, and industrial control.
- 3PEAK Announces Complete Dissolution of MCU Team
半导体技术天地
➀ 3PEAK, a domestic analog IC listed company, announced the dissolution of its MCU team, impacting approximately 80 employees, including some former members of the 2022 TI China MCU R&D team.
➁ The dissolution involves DE, AE, PM, and related positions, with most DE transferred internally to signal chain and PMS product lines.
➂ The move has garnered widespread attention from investors and industry analysts, with many speculating on the reasons and potential impact on future investments.
- Huawei Founder Ren Zhengfei Meets ICPC President, Coaches, and Award-Winning Candidates
微信公众号
➀ Huawei Founder Ren Zhengfei meets with the ICPC President, coaches, and award-winning candidates to discuss the importance of young talent and the role of technology in social development.
➁ Ren emphasizes the need for global collaboration and the exchange of ideas among young people to foster innovation and solve societal challenges.
➂ He shares insights on Huawei's global strategy, emphasizing the importance of open innovation and collaboration with international partners.
- Ren Zhengfei's Latest Speech: Huawei Struggles On
Zhishidian (Smart Things)
➀ Ren Zhengfei discusses the unstoppable trend of artificial intelligence and its impact on the labor market.
➁ He emphasizes the importance of open innovation and leveraging advanced technologies for a company's survival.
➂ Ren shares his personal entrepreneurial journey and views on the education system and world civilization exchange.
October 30
- OpenAI Collaborates with Broadcom and TSMC to Develop AI Inference Chip
微信公众号
➀ OpenAI is developing its first inference chip in collaboration with Broadcom and TSMC to support its AI systems;
➁ In addition to NVIDIA chips, OpenAI plans to use AMD chips to meet its growing infrastructure needs;
➂ OpenAI has researched various plans to diversify chip supply and reduce costs, including internal design and manufacturing, but has temporarily abandoned this ambitious plan due to high costs and time requirements;
➃ OpenAI has formed a team of about 20 people led by Richard Ho and Thomas Norrie to develop the chip, aiming to launch the first AI chip in 2026;
➄ OpenAI is exploring other parallel solutions and may introduce more partners in the future;
➅ The development of self-developed chips is part of a broader trend among major tech and AI companies to develop dedicated hardware to meet the unique needs of AI workloads.
- Mature Process Chip: Another Front Line of Sino-US Competition
芯潮IC
➀ The pursuit of advanced semiconductor manufacturing processes has been a peak goal for decades, leading to fierce industry competition.
➁ In the era of artificial intelligence, advanced process chips are in high demand and soaring in price.
➂ China's semiconductor industry has been focusing on mature process chips in the face of strict export controls by the US.
➃ China's domestic demand for mature process chips is expected to reach 90% by 2030.
- China's Domestic MCU Growth Accelerates with Automotive Demand
芯师爷
➀ Shanghai Xinwang Weiye Microelectronics Technology Co., Ltd. (Xinwang Micro) is a high-tech enterprise specializing in developing high-performance analog-digital mixed-signal MCU&DSP products based on its自主研发 KungFu instruction set and core architecture.
➁ Xinwang Micro's product line includes MCU, power supply, and radio frequency, with its products certified by ISO26262 ASIL-D functional safety process and IATF16949 automotive quality management system.
➂ Xinwang Micro's KungFu core series MCU showcases high performance, high reliability, and high integration, widely used in automotive, smart home, industrial, and energy storage fields.
- China's Nanoprinting Technology Rises as a Potential Alternative to Photolithography in Semiconductor Manufacturing
芯师爷
➀ The 14th China International Nanotechnology Industry Expo concluded successfully, showcasing advancements in nanotechnology.
➁ PuLing Technology, a leading nanoprinting company, offers a range of products and services for various industries.
➂ Nanoprinting technology has distinct advantages over photolithography in terms of precision and cost, but challenges remain in high-precision applications.
- Next-Gen Hybrid Memory Aims to Reduce AI Energy Consumption
IEEE电气电子工程师学会
➀ Stanford University is researching a hybrid memory that combines the density of DRAM with the speed of SRAM, funded by CHIPS and Science Act.
➁ The research is part of the California Pacific Northwest AI Hardware Center project, which will receive $16.3 million from the US Department of Defense.
➂ The team, led by H.S. Philip Wong, focuses on developing more energy-efficient hardware for AI, with memory being the core.
➃ The hybrid gain cell memory combines the small footprint of DRAM with the almost as fast speed of SRAM.
➄ The gain cell, similar to DRAM, uses a second transistor instead of a capacitor to store data, with the data stored as charge on the gate of the transistor.
➅ Reading signals are无损 in the gain cell, and the reading transistor provides gain to the storage transistor during reading.
➆ Liu and Wong's mixed gain cell memory, combining silicon read transistors with indium tin oxide write transistors, overcomes limitations and achieves a data retention time of over 5000 seconds.
➇ These hybrid storage cells can be integrated into logic chips, potentially changing the way memory is used in computers.
- The Comprehensive Guide to Chip Technology and Equipment: An In-Depth Explanation
Unknown
➀ The article delves into the significance of WFE (wafer fabrication equipment) and its role in semiconductor manufacturing.
➁ It explains the importance of wet cleaning, CMP, and etching processes, and their application in semiconductor manufacturing.
➂ The text covers advanced techniques such as CVD, PVD, and ALD, discussing their uses in depositing various materials.
➃ The author highlights the challenges and opportunities in the development of semiconductor equipment, particularly focusing on the advanced EUV lithography and mask inspection technologies.
➄ The article also touches upon the importance of PR Stripper, Ashing, and oxidation processes in semiconductor manufacturing.
October 29
- Wintek Technology's Net Profit Down 80% in First Three Quarters: ODM Business Incurs Over 1.2 Billion Yuan Loss
旭日大数据
➀ Wintek Technology's net profit for the first three quarters of 2024 decreased by 80% to 414 million yuan;
➁ The ODM business incurred a loss of over 1.2 billion yuan in the first three quarters;
➂ The third quarter saw a significant improvement in the ODM business, with a net loss of 357 million yuan (including convertible bond interest expenses of 108 million yuan);
➃ The semiconductor business achieved a net profit of 6.66 billion yuan in the third quarter, with a gross margin of 40.5%;
➄ The ODM business revenue increased by 45.58% year-on-year in the third quarter;
➅ The company's semiconductor business revenue increased by nearly 20% year-on-year in the first three quarters;
➆ The company's semiconductor business revenue from the automotive sector accounted for 63.00% of the total.
- Chinese Police Arrest Former Samsung Employee for Alleged Espionage in Semiconductor Information Leak to South Korea
芯智讯
➀ A 50-year-old South Korean man was arrested by Chinese police on charges of espionage for allegedly leaking Chinese semiconductor information to South Korea.
➁ He worked as an ion implantation technician at Samsung Electronics for over two decades and later joined China's largest storage chip manufacturer, CXMT.
➂ He was arrested in December 2023 and has been detained for over five months.
- 2 Companies Reveal Earnings: Vehicle-grade SiC Market Share to Reach 50%; Installation Volume Exceeds 910,000 Units
行家说三代半
➀ Anessem and Corelink Integrated have recently announced their Q3 2024 earnings reports, highlighting the growth of their SiC businesses in the automotive sector.
➁ Anessem's automotive revenue increased by 5% year-on-year, driven by SiC and ADAS image sensor businesses.
➂ Corelink Integrated's power module installation volume exceeded 910,000 units, with a significant increase in revenue from new energy vehicle and consumer sectors.
- Global Subsidies for TSMC: A Race for Chipmaking Dominance
华商韬略
➀ The recent massive subsidies for TSMC by the US, EU, Japan, and China have sparked attention, with news of accidents and construction progress at their factories.
➁ TSMC's European factory in Dresden, Germany, has started construction, with an investment of over 10 billion euros, aiming to produce automotive semiconductors by 2027.
➂ The US is providing TSMC with up to $66 billion in subsidies for its Arizona factory, aiming to boost the US share in advanced chip production to 20% by 2030.
➃ Japan is offering up to 1.2 trillion yen in subsidies for TSMC's factories in Kumamoto, with the first factory expected to start production by the end of 2024.
➄ TSMC's Nanjing factory in China has been granted 'verified end-user' authorization by the US Commerce Department, allowing unrestricted supply of semiconductor equipment.
➅ The article discusses the strategic implications of these subsidies for the global semiconductor industry.
- Private Equity Giant Ge Weidong Invests 600 Million Yuan in Jingjiawei
WeChat Official Account
➀ Ge Weidong, a private equity magnate, has invested 600 million yuan in Jingjiawei's private placement;
➁ Jingjiawei's private placement raised over 3.8 billion yuan, with a subscription price of 59.91 yuan per share;
➂ Jingjiawei, a domestic GPU company, focuses on independent research and development of GPU chips, with a net profit increase of 53.28% in the first three quarters.
- US to Limit Investment in China in Semiconductors and AI from 2025
Nikkei Asian Review
➀ The new regulations will take effect from January 2, 2025, targeting investments in China in semiconductors, quantum, and AI technologies that may pose a national security threat;
➁ The U.S. government has been strictly limiting the export of advanced semiconductors to China and has enhanced the review of inward direct investments from China by the Committee on Foreign Investment in the United States (CFIUS);
➂ The restrictions will include acquisitions of Chinese enterprise shares and joint ventures in targeted areas, as well as investments in advanced semiconductor companies and quantum research facilities in China.
- Analog Devices Reports Record Revenue of $3.66 Billion in Q3 2021
Weixin Official Accounts Platform
➀ Ansenic Semiconductor's revenue for the third quarter increased by 2% year-over-year to $1.76 billion, meeting expectations;
➁ Non-GAAP EPS was $0.99, up $0.02 from the previous year;
➂ Adjusted operating profit was $496.5 million, exceeding analyst expectations of $483.4 million.
- Semiconductor Equipment Crisis: ASM Restructuring and Mass Layoffs!
微信公众号
➀ ASM Korea, a Dutch semiconductor equipment giant focusing on ALD, PEALD, and epitaxy equipment, has undergone a series of restructuring actions involving personnel optimization and department migration.
➁ Despite this, some industry observers believe that the current situation is more a reflection of the competitive landscape in the AI field rather than a full-scale crisis in the semiconductor industry.
➂ The headquarters of ASM is not immune to the impact of semiconductor industry fluctuations, with market predictions suggesting that this impact may spread to the Korean branch.
- Hybrid Bonding: Progress and Challenges in Advanced Packaging
Semiconductor Industry Observation
➀ Hybrid bonding is gaining attention in advanced packaging for its ability to provide the shortest vertical connections between chips with similar or different functions, as well as better thermal, electrical, and reliability results.
➁ Despite some chip manufacturers adopting hybrid bonding in large-scale manufacturing, the high cost of the process makes it unsuitable for mass adoption. Challenges include better copper dimple uniformity, faster wafer-to-chip placement, and better alignment, multiple bonding and debonding carriers (which increase costs), and low-temperature annealing capabilities.
➂ The development of AI chips and modules is a significant driver for hybrid bonding and advanced packaging. High-performance and high prices of these chips help to drive industry development.
- Chaining the Stars: CoreChip's AD1000 Autonomous Driving Chip Shines Bright
半导体行业观察
➀ CoreChip's AD1000 autonomous driving chip has achieved significant milestones in performance and verification;
➁ The chip has demonstrated exceptional performance in key indicators such as CPU, AI computing power, ISP processing, and NPU local storage capacity;
➂ The AD1000 chip is set to reshape the market landscape with its advanced capabilities and features, including support for Transformer large models and ASIL-D functional safety island.
- Exploring the New Path of Information Technology Innovation and Replacement: Lessons from 'Rongxin' Product Solutions
IT Technology Sharing-Lao Zhang
➀ The challenges faced by information technology innovation and replacement, including hardware performance gap, software ecosystem, product core IP sustainability, and market product cost-performance;
➁ Understanding the concept of 'hardware middleware' and its role in solving the problems of performance, ecosystem compatibility, and cost-performance of domestic CPUs, GPUs, and other components;
➂ Introduction to the products and solutions of 'Rongxin Yuanzhi', including data acceleration cards for domestic CPU servers, AI acceleration cards for domestic GPU scenarios, and data acceleration cards for storage business;
➃ Thoughts on the trend of information technology innovation and replacement, emphasizing the importance of reducing comprehensive costs while ensuring usability and ease of use.
- ECOC2024: TFLN MZM
光芯之路
➀ HyperLight Corp is promoting its end-to-end TFLN PIC solutions with excellent electro-optical bandwidth, low energy consumption, and mass production capabilities.
➁ HUST's MZM based on LNOI has a 3dB electro-optical bandwidth of over 67/67/48 GHz in the 800nm band.
➂ Southeast University has developed TFLN electro-optical modulators with a bandwidth of up to 110GHz and a half-wave voltage as low as 2V.
- Celestial AI's Connection Revolution: The Future of Photon Interconnectivity!
Celestial AI
➀ Celestial AI has incorporated a thermally stable optical modulator in its chips, with power consumption of hundreds of watts, eliminating the need for a digital signal processor (DSP) due to its high signal-to-noise ratio (SNR) and low bit error rate (BER).
➁ Celestial's photonic interconnect module offers a memory capacity of 2.07TB and a bandwidth of 7.2Tbps, with a latency of just 100 nanoseconds.
➂ The system supports up to 115Tbps of network switching with 916 modules, providing 33Tb of memory capacity for backend/extended AI.
October 28
- Sensetime Secretly Spin-Offs Chip Business Post Layoffs!
芯榜上海
➀ Sensetime has secretly spun off its chip business after layoffs, attracting widespread attention.
➁ The company has completed billion-level financing to alleviate financial pressure.
➂ Sensetime has been seeking breakthroughs in the AI chip field since 2018.
- 3D Optical Lithography: Techniques and Applications
Unknown
➀ Introduction to 3D micro-nano pattern fabrication using optical lithography technology;
➁ Explanation of grayscale lithography and its technical realization;
➂ Principle and application of 3D interference lithography;
➃ Advantages and applications of stereolithography and 3D micro-printing technology;
➄ The development trend of optical lithography technology and its role in micro-nano processing field.
- Sanke Electric to Close Factory!
Unknown
➀ Sanke Electric announced the closure of its滋贺工厂 due to damage from the 2024 January earthquake in Noto Peninsula;
➁ The closure is because the factory facilities are difficult to use after the earthquake;
➂ The production of the滋贺工厂 will be transferred to other Sanke Electric factories and overseas production bases by the end of April 2026.
- A Chengdu Semiconductor Company, After 15 Rounds of Financing, is Set to be Sold
Touzhong Net
➀ Chengdu semiconductor company Yichong Technology is set to be sold to Jinfeng Mingyuan;
➁ The company has completed 15 financing rounds with more than 30 investors;
➂ Jinfeng Mingyuan aims to strengthen its position in the consumer electronics and new energy vehicle markets through the acquisition.
- Intel Announces Expansion of Chengdu Packaging and Testing Base! Total Investment Exceeds $4 Billion!
芯智讯
➀ Intel announced the expansion of its Chengdu Packaging and Testing Base in Beijing, adding server chip packaging and testing services.
➁ The expansion aims to enhance local supply chain efficiency and support Chinese customers.
➂ The new Intel Customer Solution Center will be a one-stop platform for industry solutions.
➃ Intel has invested over $4 billion in the Chengdu base since 2003.
➄ Chengdu is a key production center for Intel's mobile device microprocessors.