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August 7
- Machine Learning Helps Find Stronger Polymers
➀ MIT and Duke University researchers developed a machine learning method to identify polymer crosslinkers that enhance tear resistance, potentially reducing plastic waste;
➁ The study focused on ferrocene-based mechanophores, achieving materials four times tougher than conventional counterparts with unexpected AI-discovered molecular features;
➂ This scalable approach accelerates discovery of functional materials for applications like stress sensing, catalysis, and drug delivery beyond traditional polymer research limitations.
- High Temperature Automotive Inductors
➀ Vishay Intertechnology launches high-temperature automotive inductors (IHDM-1107BBEV series) designed for operation up to +180°C, offering stable performance and 30% higher current handling than ferrite alternatives;
➀ Crafted with powdered iron cores and edge-wound coils, these inductors feature ultra-low DCR (down to 0.22 mΩ), soft saturation behavior, and AEC-Q200 qualification for automotive reliability;
➂ Ideal for EVs, hybrids, and high-power systems, the inductors are available in two variants with customizable configurations for DC/DC converters, inverters, and on-board chargers.
- Wi-Fi 8 Promises 25% Performance Boost In Unstable Conditions
➀ Wi-Fi 8 focuses on improving performance in unstable conditions like weak signals and high interference, targeting 25% higher throughput, lower latency, and reduced packet loss;
➁ Key technologies include network-level coordination (Co-SR, Co-BF) and enhanced modulation schemes to stabilize connections in dense or mobile environments;
➂ The standard is expected to achieve IEEE approval by mid-2028, with commercial availability by late 2028 as a unified release.
- Four-Channel Devices For Better HDMI
➀ Diodes Incorporated introduces two 3.3V quad-channel hybrid ReDrivers (PI3HDX12311 and PI3HDX6311) to enhance HDMI 2.1/2.0 signal integrity and support 8K video transmission;
➁ The devices optimize power consumption through HPD pin monitoring and integrated DDC listeners, while compensating for signal losses in long-distance or complex PCB traces;
➂ Designed for consumer electronics and computing platforms, they enable high-resolution video in TVs, gaming consoles, laptops, and docking stations with flexible control modes.
August 6
- What Does It Take to Build Seamless Ambient Systems?
➀ Explores technical challenges in ambient computing, including sensor reliability, edge processing, and seamless device integration;
➁ Highlights human factors such as trust, privacy, and accessibility crucial for user adoption;
➂ Discusses the balance between automation and user control for truly smart, invisible systems.
- Hardware Engineer (Internship) At SKEYEBOTS At Kochi
➀ SKEYEBOTS offers a Hardware Engineer internship in Kochi, focusing on autonomous drone system design;
➁ Responsibilities include electronics prototyping, firmware development using Embedded C, and 3D modeling/CFD simulations;
➂ Candidates gain mentorship from industry experts and potential full-time opportunities in cutting-edge robotics applications.
- JOB: Hardware Engineer End of Line At Maxwell Energy Systems In Maharastra
- JOB: Application Engineer At MAHLE In Coimbatore
- JOB: MTS – Analog Design At Micron Technology In Bengaluru
- JOB: Firmware Engineer At Eaton In Pune
- New Series Of RAID Storage Accelerators Unveiled
➀ Microchip Technology launched the Adaptec SmartRAID 4300 series, a NVMe RAID storage accelerator family designed for data centers and enterprise storage with up to 7x performance improvement using a disaggregated architecture;
➁ The solution supports NVMe/cloud SSDs, scales to 32×4 NVMe devices, and integrates advanced security features like hardware root of trust and self-encrypting drives;
➂ Power efficiency optimizations and comprehensive management tools (web GUI, CLI, BMC) enhance deployment flexibility for server OEMs and enterprise users.
- Compact Film Capacitors For Reliability
➀ TDK introduces EPCOS B3264xH series metallized film capacitors for high-frequency resonant applications, featuring pulse handling up to 6,500 V/µs and automotive-grade AEC-Q200 compliance;
➁ Offers compact sizes (13.0x4.0x9.0 mm to 26.5x14.5x29.0 mm), wide capacitance range (2.2–470 µF), and 200,000-hour lifespan at +85°C;
➂ Targets EVs (OBCs, DC-DC converters), SMPS, and UPS systems, with SPICE/ANSYS models for integration support.
August 5
- Integrated Laser 3D Profiler, Simplifying Automated Inspection
➀ Teledyne DALSA introduces the Z-Trak Express 1K5, a high-speed 3D laser profiler capturing up to 5,000 profiles/second for automated industrial inspection;
➁ Features a 1,700mm horizontal field-of-view for wide-object scanning and supports applications in automotive, battery production, and logistics with precise micrometre-level measurements;
➂ Includes integrated software suite (Z-Trak 3D Apps Studio, Sherlock™8) and compatibility with industrial protocols like TCP/IP and ProfiNet for seamless PLC integration.
- Robotic Actuator Developed Using Muscle Protein
➀ Researchers at POSTECH developed a paper-thin robotic actuator inspired by human muscle protein myosin, enabling precise multi-axis movements through pneumatic control;
➁ The actuator features layered air chambers and pneumatic pathways, achieving six-directional motion (including rotation) even when bent;
➂ Potential applications include surgical robots, industrial inspection in confined spaces, and home cleaning systems, with demonstrated success in pipeline maintenance scenarios.
- JOB: Senior Engineer II – IC Package Design At Microchip In Bengaluru And Chennai
- JOB: Engineer, PCB Design At Molex In Bengaluru
- JOB: Engineer I (Power & Battery) At IdeaForge In Bengaluru
- JOB: Engineer – Electronics Hardware Design At Eaton In Pune
- New Tester Tests HBM Chips Faster
➀ Teradyne launched the Magnum 7H tester for high-speed, high-accuracy testing of HBM chips used in AI/GPU applications;
➁ Supports HBM2E to HBM4E, with 4.5 Gbps speed, 9,216 digital pins, and 1.6x production throughput improvement;
➂ Enables pre- and post-singulation testing for quality assurance in AI/cloud hardware manufacturing.
- Ultrasound-Based Wireless Charging Harnessed For Medical Use
➀ Researchers at DGIST developed ultrasound-based wireless charging for medical implants using a dual-layer piezoelectric harvester;
➁ The technology achieves over 20% higher energy conversion efficiency and charges commercial batteries in 2 hours within the human body;
➂ Eliminates risky replacement surgeries and aims for sub-1-hour charging via semiconductor integration.
August 4
- Embedded Systems – Internship At IG Drones In Bhubaneswar
➀ IG Drones offers a 6-month in-office internship in Bhubaneswar focused on embedded systems development.
➁ Responsibilities include firmware debugging, sensor integration, UAV flight controller tuning, and PCB testing using C/C++, Python, and IoT tools.
➂ Applicants need proficiency in Arduino, Raspberry Pi, and circuit design, with 4 openings available.
- JOB: Systems Verification Engineer At Fluke Health Solutions In Bengaluru
- JOB: Associate – Semiconductor At Lumenci In Gurugram
- JOB: Engineer II – Firmware At Seagate In Pune
- Is Quantum Computing The Future?
➀ Fujitsu aims to develop a 10,000-physical-qubit superconducting quantum computer by 2030, targeting fault tolerance and 250 logical qubits;
➁ The initiative focuses on real-world applications in materials science and integrates quantum computing with high-performance computing (HPC) platforms;
➂ Key challenges include maintaining qubit fidelity, quantum error correction, and thermal management during system scaling.
- Optimised Microcontroller Series Launched
➀ Nuvoton Technology launched the NuMicro MG51 series of 8-bit microcontrollers based on a 1T-8051 core, operating up to 24 MHz;
➁ The microcontrollers feature 2.4V–5.5V voltage range, industrial-grade temperature tolerance (-40°C to +105°C), and robust noise immunity with 7 kV ESD protection;
➂ Integrated security features include flash lock bits, SPROM for secure code execution, and unique identification (UID/UCID), targeting industrial automation, smart appliances, and energy optimization applications.
- Power And Data Tools For Modern Systems
➀ HENXV launched new power and communication products, including AC/DC converters, DC/DC converters, and bus transceivers for modern systems;
➁ The products feature high efficiency, compact designs, safety mechanisms, and support high-speed communication with low latency;
➂ Applications span industrial automation, medical devices, electric vehicles, and renewable energy, aiming to enhance reliability and simplify integration.
- Power Supplies For Industrial Automation
➀ Weidmuller launches PROeco II series power supplies for industrial automation, achieving 95% efficiency and reduced thermal stress;
➁ Features wide input voltage ranges (85-264 VAC single-phase/320-575 VAC three-phase), compact DIN-rail design with 15% space saving, and -40°C cold-start capability;
➂ Certified for global compliance (CE/cULus/UKCA), supports parallel operation of 3 units, and offers MTBF exceeding 1 million hours for harsh industrial environments.
- Simulation Reveals Structural Limits In 3D NAND Memory
➀ Simulation studies using SEMulator3D expose structural challenges in 3D NAND memory when layers exceed 300, with stress causing bending and collapse;
➁ Two DOE analyses identified that balancing silicon nitride (SiN) and oxide layer properties mitigates deformation, highlighting material optimization as key;
➂ Virtual testing offers a cost-effective method to explore designs and improve yield without physical fabrication.
August 2
- August 2025 Issue Of Electronics For You
➀ Cover story explores Small Modular Reactors' role in sustainable energy transition and India's satellite communication market potential;
➁ Features insights from semiconductor industry leaders on India's fab strategy and workforce scaling challenges;
➂ Highlights startups like Green Tiger Mobility and Xbattery Energy, alongside DIY projects including wearable-compatible buck converters and smart LED controllers.