03/21/2025, 06:27 AM UTC
斯特拉斯克莱德大学获得900万英镑资金用于集成电路封装研发Strathclyde Uni gets £9m for IC packaging R&D
斯特拉斯克莱德大学从英国创新英国（Innovate UK）获得了900万英镑的资金，用于半导体封装研发。
该目标是为功率电子半导体创建一个先进的封装线，将封装时间从数月缩短至数天。
全球材料短缺、制造能力有限以及缺乏创新设施导致英国供应链依赖国际市场获取关键组件，从而造成长时间的延误。
Strathclyde University has received £9 million from Innovate UK to pursue semiconductor packaging R&D.
The goal is to create an advanced packaging line for power electronic semiconductors that will reduce packaging times from months to days.
Global material shortages, limited manufacturing capacity, and a lack of innovation facilities have left the UK supply chain dependent on international markets for key components, leading to long delays.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的 知识扩展（Beta）。
