11/08/2024, 05:55 PM UTC
台积电N2工艺将于2025年第四季度投产TSMC N2 to enter production in Q4 2025
➀ 台积电将在2025年第四季度开始在其新竹的Fab 20工厂生产基于GAA的2nm晶圆；➁ 2026年第一季度，高雄的30k wpm Fab 22工厂也将开始生产；➂ N2P将在2026年底开始生产，但将不采用之前宣布的背面电源传输技术；➃ N2和N2P将使用台积电的NanoFlex技术；➄ N2的密度比N3E高15%，在相同功率下性能提升10%至15%，或在相同频率和复杂度下功耗降低25%至30%；➅ 2026年将推出N2E、N2P和电压增强的N2X；➆ 台积电计划中的2nm产能已超过3nm；➇ 预计2nm晶圆的成本将超过3万美元。➀ TSMC will start producing 2nm GAA-based wafers in Q4 2025 at Fab 20 in Hsinchu; ➁ The production will be followed by Fab 22 in Kaohsiung in Q1 2026; ➂ N2P production will start in late 2026 without backside power delivery; ➃ N2 and N2P will use TSMC's NanoFlex technology; ➄ N2 is 15% denser than N3E and improves performance by 10% to 15%; ➅ N2E will be followed by N2P and N2X in 2026; ➆ TSMC's planned capacity for 2nm is more than for 3nm; ➇ 2nm wafers are expected to cost $30k+.
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