06/17/2024, 03:51 AM UTC
三星为2025年的HBM4准备先进的3D芯片封装技术Samsung preps for advanced 3D chip packaging, getting ready for HBM4 in 2025
1、三星计划在接下来的12个月内推出HBM4的3D封装服务。2、这项技术旨在为2025年发布的下一代AI GPU服务。3、新的3D封装技术被称为SAINT-D，将用于将HBM芯片垂直堆叠在GPU上方，以提高速度，无需硅中介层。1. Samsung is preparing to launch 3D packaging services for HBM4 within the next 12 months. 2. The technology is intended for next-gen AI GPUs, which will be released in 2025. 3. The new 3D packaging technology, called SAINT-D, will be used to stack HBM chips vertically on top of a GPU for increased speed, without the need for a silicon interposer.---
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