02/18/2025, 02:23 PM UTC
芬兰VTT技术研究中心获得2900万欧元资金用于芯片封装开发VTT awarded €29m for packaging development
<p>➀ 芬兰VTT技术研究中心在欧盟APECS试点线项目中获得了2900万欧元资金用于芯片封装开发。</p><p>➁ VTT将专注于6G网络的射频技术，以及光学微系统和芯片封装方法的发展。</p><p>➂ VTT参与FAMES和NanoIC试点线项目，并在Kvanttinova（一个由VTT、阿尔托大学和埃斯波市共同开发的微电子和量子技术研发中心）运营。</p><p>➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.</p><p>➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.</p><p>➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.</p>
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