<p>➀ SK Hynix's HBM4 achieves over 10Gbps per-pin speed, exceeding JEDEC's 8Gbps standard by 25%, enhancing AI accelerator performance;</p><p>➁ Utilizes 1bnm process and Mass Reflow Molded Underfill (MR-MUF) technology to ensure production reliability and readiness for mass manufacturing;</p><p>➂ Positions SK Hynix as a key supplier for next-gen AI chips, benefiting clients like NVIDIA seeking premium memory solutions.</p>