<p>➀ SK Hynix announced the completion of HBM4 development and readiness for mass production, marking the world's first next-gen memory for AI applications; </p><p>➁ HBM4 doubles bandwidth with 2,048 I/O terminals, improves power efficiency by 40%, and boosts AI service performance by up to 69%, addressing data center power challenges; </p><p>➂ The company utilized advanced MR-MUF and 1bnm process technologies to ensure stable production, exceeding JEDEC standards with 10Gbps operating speed.</p>