05/28/2025, 05:29 AM UTC
台积电在阿姆斯特丹技术研讨会上大放异彩TSMC dazzles in Amsterdam
➀ 台积电在2025欧洲技术研讨会上重点展示了N3系列制程的规模化生产,包括为CPU优化的N3X、面向性价比产品的N3C及车规级N3A节点;
➁ 推出N2(2nm)及A16/A14先进制程路线图,CFET晶体管设计实现近两倍密度提升,并规划2026-2029年量产时间表;
➂ 公布3D Fabric封装技术突破(如5.5/9.5倍光罩尺寸CoWoS)、面向AI的晶圆级系统方案SoW-X,以及车用存储技术、物联网射频N4C和高压显示驱动等创新应用。
➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications;
➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density;
➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。