03/26/2025, 06:23 AM UTC
2025年前端晶圆厂设备支出预计增长2%，达到1100亿美元2% 2025 growth forecast for front-end fab equipment
➀ SEMI宣布，2025年前端晶圆厂设备支出预计同比增长2%，达到1100亿美元；
➁ 这种增长由高性能计算和内存领域的需求以及人工智能的日益集成驱动；
➂ 逻辑与微处理领域预计将成为增长的关键驱动力，2025年投资将达到520亿美元，2026年将达到590亿美元。
➀ SEMI announced a 2% year-over-year growth forecast for front-end fab equipment spending in 2025, reaching $110 billion;
➁ This growth is driven by demand in HPC and memory sectors, as well as the increasing integration of AI;
➂ The Logic & Micro segment is expected to be a key driver of growth, with investments reaching $52 billion in 2025 and $59 billion in 2026.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
