<p>➀ Infineon and Rohm signed an MoU to collaborate on SiC power device packages, enabling each other as second sources to enhance customer design and procurement flexibility;</p><p>➁ Rohm adopts Infineon's top-side cooling platform (e.g., TOLT, Q-DPAK) for improved power density, while Infineon integrates Rohm's DOT-247 package to expand its SiC half-bridge solutions;</p><p>➂ The partnership aims to extend to silicon and wide-bandgap technologies (SiC, GaN) for broader customer solutions and industry innovation.</p>