Intel Delays $100 Billion Ohio Semiconductor Fab to 2030
03/03/2025, 03:09 AM UTC
英特尔推迟价值1000亿美元的俄亥俄半导体工厂至下一个十年：现在至少2030年Intel delays expensive $100 billion Ohio semiconductor fab into the next decade: now in 2030
➀ 英特尔将其原定于2025年建设的俄亥俄州半导体制造工厂推迟至至少2030年。
➁ 俄亥俄州的第一个阶段（Mod 1）现在预计将在2030年完成，生产预计将在2030年至2031年之间开始。
➂ 英特尔耗资280亿美元的俄亥俄州芯片制造工厂位于纽阿尔班，推迟建设是为了使工厂运营与市场需求相一致。
➀ Intel has delayed its Ohio semiconductor manufacturing site, originally planned for 2025, to at least 2030.
➁ The first phase of the Ohio site (Mod 1) will now be completed in 2030, with production starting between 2030 and 2031.
➂ Intel's $28 billion Ohio chipmaking factories are located in New Albany, with the delay made to align factory operations with market demand.
Intel has announced a further delay in the construction of its Ohio One semiconductor manufacturing site, originally scheduled for completion in 2025. The project has now been pushed back to at least 2030, with the first phase, known as Mod 1, expected to be completed in 2030 and production to commence between 2030 and 2031. Mod 2 is anticipated to be operational in 2032.
The Ohio chipmaking factories, valued at $28 billion, are situated in New Albany. The delay is attributed to Intel's strategy to align its factory operations with market demand and to manage capital responsibility effectively. Naga Chandrasekaran, the executive vice president and general manager of Intel Foundry Manufacturing, emphasized that the company remains committed to Ohio, with ongoing hiring and training of Ohioans at Intel's fabs in Arizona, New Mexico, and Oregon.
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