09/29/2024, 09:51 PM UTC
台积电发布最新1.6nm技术，将挑战极紫外光刻技术TSMC Unveils Latest 1.6nm Technology, Set to Compete with Extreme Ultraviolet Lithography
➀ 台积电开发了1.6nm（A16）技术，预计2026年投产；➁ 台积电的A16TM技术将采用领先的纳米片晶体管和创新的背侧电源轨方案；➂ 与苹果的N2P工艺相比，台积电的1.6nm技术旨在实现高达1.1倍的芯片密度提升；➃ 台积电与Synopsys和ANSYS合作，推进AI和多模芯片设计。➀ TSMC has developed the 1.6nm (A16) technology, expected to be in production by 2026; ➁ TSMC's A16TM technology will adopt leading nanosheet transistors and innovative backside power rail solutions; ➂ TSMC's 1.6nm technology aims to improve chip density by up to 1.1 times compared to Apple's N2P process; ➃ TSMC is collaborating with Synopsys and ANSYS to advance chip design for AI and multi-mode chips.
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