03/31/2025, 02:47 PM UTC
高精度面板级封装系统High-Precision Panel-Level Packaging System
<p>➀ Toray Engineering Co., Ltd. 开发了 UC5000，这是一种用于面板级封装 (PLP) 的高精度半导体封装系统，特别是在 AI 服务器应用方面需求增长。</p><p>➁ UC5000 使用热压键合 (TCB) 技术在大面板上实现了 ±0.8μm 的芯片封装精度，支持硅晶圆和玻璃基板。</p><p>➂ 主要特点包括先进的 TCB 技术、高精度封装和翘曲校正转移技术，解决了玻璃面板加工中的翘曲和材料膨胀等挑战。</p><p>➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.</p><p>➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.</p><p>➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.</p>
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