05/27/2025, 12:44 PM UTC
三星计划于2028年用玻璃基板替代硅基板Samsung will reportedly replace silicon with glass interposers in 2028
➀ 据报道，三星计划最早于2028年将芯片封装中的硅基板替换为玻璃基板；➁ 这一转变旨在降低制造成本并提高性能；➂ 三星的战略是生产更小的玻璃基板，以加速原型设计和市场进入。➀ Samsung is reportedly planning to replace silicon with glass interposers in chip packaging as early as 2028; ➁ This shift aims to reduce manufacturing costs and improve performance; ➂ Samsung's strategy involves producing smaller glass units to accelerate prototyping and market entry.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
