02/18/2025, 10:31 AM UTC
安靠拓展其芯片封装和测试设施,以支持下一代应 用ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
➀ 安靠在马来西亚彭亨正式启用其第五座工厂;
➁ 新设施将提升公司的封装和测试能力;
➂ 该扩张计划是安靠扩大马来西亚设施面积的策略之一。
➀ ASE has officially launched its fifth plant in Penang, Malaysia;
➁ The new facility will enhance the company's packaging and testing capabilities;
➂ The expansion is part of a strategic plan to increase the floor space of ASE's Malaysia facility.
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。