05/01/2025, 05:02 AM UTC
TSMC SoW-X的出现，玻璃基板真的会变得不再需要吗？Will Glass Substrates Become Unnecessary with TSMC SoW-X?
➀ 玻璃基板主要分为两类：用玻璃替换基板的核心材料，以及用玻璃替换中间层。
➁ 玻璃中间层的优点包括提高生产效率和降低厚度，解决了半导体制造中通孔的挑战。
➂ TSMC的SoW-X不使用FCBGA，而是采用不同的方法进行电气和信号连接。
➃ 由于成本高和技术挑战，玻璃基板预计不会取代所有现有技术，但仍将适用于某些应用。
➀ Glass substrates are divided into two categories: replacing the core material with glass and replacing the interposer with glass.
➁ The benefits of glass interposers include higher productivity and reduced thickness, solving the challenge of via holes in semiconductor manufacturing.
➂ TSMC's SoW-X does not use FCBGA, instead using a different method for electrical and signal connections.
➃ Glass substrates are not expected to replace all current technologies due to high costs and technical challenges, but will still be needed for certain applications.
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