10/09/2024, 07:38 AM UTC
CIOE2024：材料工艺平台相关CIOE2024: Material and Process Platform Updates
➀ CUMEC的SIN on SOI平台更新，配备1.5dB/cm的strip硅波导和2~3dB/cm的strip SIN波导；➁ CUMEC的硅光+TFLN异质集成技术平台介绍，具有较低的LN性能带宽；➂ 晶圆级三维集成先进封装工艺平台和面向芯粒集成的硅桥的进展；➃ 奇芯光电的SINOI平台，具有SIN的优势和PLC的优势；➄ SITRI的90nm薄硅集成工艺和硅光芯片与LN调制器晶圆级单片集成；➅ 晶正的LTOI晶圆，具有与LNOI相当的电光调制效率，但成本更低；➆ LUXTELLIGENCE的LNOI代工服务和测试服务；➇ Ligentec的SIN平台，传输损耗小于1dB/m，可处理大于5W的光功率。➀ Updates on CUMEC's SIN on SOI platform, featuring 1.5dB/cm strip silicon waveguide and 2~3dB/cm strip SIN waveguide; ➁ Introduction of CUMEC's silicon photonics + TFLN hetero-integration technology platform with LN performance bandwidths; ➂ Advancements in wafer-level 3D integration advanced packaging processes and silicon bridge for chiplet integration; ➃ Qi Xin Optoelectronics' SINOI platform with SIN advantage and PLC benefit; ➄ SITRI's 90nm thin silicon integration process and wafer-level monolithic integration of silicon photonics chips with LN modulators; ➅ Jingsheng's LTOI wafer offering comparable electro-optical modulation efficiency to LNOI with lower cost; ➆ Luxtellence's LNOI foundry services and testing services; ➇ Ligentec's SIN platform with transmission loss <1dB/m and power handling capability >5W.
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