03/07/2025, 04:49 AM UTC
打破国际大厂芯片先进封装垄断，杭州团队获数亿元融资 | 36氪首发Huzhou Team Breaks International Chip Advanced Packaging Monopoly, Secures Hundreds of Millions in Financing | 36Kr Exclusive
➀ 杭州团队获得数亿元融资，打破国际芯片封装垄断；
➁ 晶通科技， 专注于晶圆级扇出型封装和Chiplet集成解决方案，致力于先进封装技术；
➂ 先进封装市场快速增长，扇出封装和Chiplet集成预计将迎来显著增长。
➀ Huzhou team secures hundreds of millions in financing to break international chip packaging monopoly;
➁ Jingtong Technology, a wafer-level fan-out packaging and Chiplet integration solution provider, focuses on advanced packaging technology;
➂ The market for advanced packaging is growing rapidly, with fan-out packaging and Chiplet integration expected to see significant growth.
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