03/06/2025, 04:55 AM UTC
半导体OSAT巨头进军先进封装Semiconductor OSAT Giants' Expansion into Advanced Packaging
➀ 芯片封装和测试行业在半导体供应链中至关重要，传统的OSAT巨头面临着来自先进封装技术的挑战。
➁ 如OSAT的领导者日月光、安靠和长电科技等公司正在全球范围内扩张，并专注于先进封装以保持其竞争优势。
➂ 关键策略包括海外扩张、投资新工厂和技术创新以满足对先进封装不断增长的需求。
➀ The semiconductor packaging and testing industry is crucial in the semiconductor supply chain, with traditional giants like OSAT facing challenges from advanced packaging technologies.
➁ Companies like OSAT leaders such as OSAT, Amkor, and Chipmos are expanding globally and focusing on advanced packaging to maintain their competitive edge.
➂ Key strategies include overseas expansion, investment in new factories, and technological innovation to meet the growing demand for advanced packaging.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
